Apparatus and method for singulating semiconductor wafers
First Claim
1. A method for dicing a semiconductor substrate comprising the steps of:
- (a) aiming a laser beam at a layer placed over a top surface of the substrate, the layer having a first absorption coefficient relative to a wavelength of the laser beam;
(b) absorbing energy from the laser beam into the layer based on the first absorption coefficient;
(c) forming a first set of scribe lines in a first direction in the layer by scanning the laser beam across the layer, the laser beam removing at least a portion of the layer;
(d) forming a second set of scribe lines in a second direction in the layer by scanning the laser beam across the layer and removing at least a portion of the layer with the laser beam, the second direction substantially orthogonal to the first direction;
(e) cutting through the substrate along the second set of scribe lines with a saw blade to form a respective first set of kerfs; and
(f) cutting through the substrate along the first set of scribe lines with the saw blade to form a respective second set of kerfs, wherein the substrate has a second absorption coefficient relative to the wavelength of the laser beam, the second absorption coefficient less than the first absorption coefficient by about an order of an order of magnitude.
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Accused Products
Abstract
A method and apparatus for singulating semiconductor wafers is described. The method comprises the steps of aiming a laser beam at a layer placed over the substrate; absorbing energy from the laser beam into the layer; forming scribe lines in the layer by scanning the laser beam across the layer; and cutting through the substrate along the scribe lines with a saw blade to singulate the wafer. The apparatus includes a laser placed over the coating layer of the substrate, and a saw blade mounted over a surface of the substrate. The coating layer has a first absorption coefficient relative to a wavelength of the laser and the semiconductor substrate has a second absorption coefficient less than the first absorption coefficient. Energy from the laser beam is absorbed into the coating layer to form scribe lines therein, and the saw blade cuts through the substrate along the scribe lines.
79 Citations
44 Claims
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1. A method for dicing a semiconductor substrate comprising the steps of:
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(a) aiming a laser beam at a layer placed over a top surface of the substrate, the layer having a first absorption coefficient relative to a wavelength of the laser beam;
(b) absorbing energy from the laser beam into the layer based on the first absorption coefficient;
(c) forming a first set of scribe lines in a first direction in the layer by scanning the laser beam across the layer, the laser beam removing at least a portion of the layer;
(d) forming a second set of scribe lines in a second direction in the layer by scanning the laser beam across the layer and removing at least a portion of the layer with the laser beam, the second direction substantially orthogonal to the first direction;
(e) cutting through the substrate along the second set of scribe lines with a saw blade to form a respective first set of kerfs; and
(f) cutting through the substrate along the first set of scribe lines with the saw blade to form a respective second set of kerfs, wherein the substrate has a second absorption coefficient relative to the wavelength of the laser beam, the second absorption coefficient less than the first absorption coefficient by about an order of an order of magnitude. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 16, 18, 20)
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14. A method for dicing a semiconductor substrate comprising the steps of:
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(a) aiming a laser beam at a layer placed over a top surface of the substrate, the layer having a first absorption coefficient relative to a wavelength of the laser beam;
(b) absorbing energy from the laser beam into the layer based on the first absorption coefficient;
(c) forming a first set of scribe lines in a first direction in the layer by scanning the laser beam across the layer, the laser beam removing at least a portion of the layer;
(d) forming a second set of scribe lines in a second direction in the layer by scanning the laser beam across the layer and removing at least a portion of the layer with the laser beam, the second direction substantially orthogonal to the first direction;
(e) cutting through the substrate along the second set of scribe lines with a saw blade to form a respective first set of kerfs; and
(f) cutting through the substrate along the first set of scribe lines with the saw blade to form a respective second set of kerfs, wherein the substrate has a second absorption coefficient relative to the wavelength of the laser beam, the second absorption coefficient less than the first absorption coefficient by about an order of an order of magnitude.
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15. A method for dicing a semiconductor substrate comprising the steps of:
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(a) aiming a laser beam at a layer placed over a top surface of the substrate;
(b) absorbing energy from the laser beam into only the layer;
(c) forming a first set of scribe lines in a first direction in the layer by scanning the laser beam across the layer, the laser beam removing at least a portion of the layer;
(d) forming a second set of scribe lines in a second direction in the layer by scanning the laser beam across the layer and removing at least a portion of the layer with the laser, the second direction substantially orthogonal to the first direction;
(e) cutting through the substrate along the second set of scribe lines with a saw blade to form a respective first set of kerfs, and (f) cutting through the substrate along the first set of scribe lines with the saw blade to form a respective second set of kerfs, wherein the layer has a first absorption coefficient and the substrate has a second absorption coefficient relative to a wavelength from the laser beam, the first absorption coefficient greater than the second absorption coefficient.
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17. A method for dicing a semiconductor substrate using a laser and a saw blade, the method comprising the steps of:
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(a) aiming the laser at a layer placed over a top surface of the substrate;
(b) absorbing energy from the laser into the layer;
(c) forming a first set of scribe lines in a first direction in the layer by scanning the laser across the layer, the laser removing at least a portion of the layer;
(d) forming a second set of scribe lines in a second direction in the layer by scanning the laser across the layer and removing at least a portion of the layer with the laser, the second direction substantially orthogonal to the first direction;
(e) cutting a first set of kerfs in the substrate with the saw blade along the second set of scribe lines; and
(f) cutting a second set of kerfs in the substrate with the saw blade along the first set of scribe lines, wherein the layer has a first absorption coefficient and the substrate has a second absorption coefficient relative to a wavelength of the laser beam, the first absorption coefficient greater than the second absorption coefficient by about an order of an order of magnitude, and the first set of kerfs and the second set of kerfs form a plurality of dice from the substrate.
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19. A method for dicing a semiconductor substrate using a laser and a saw blade, the method comprising the steps of:
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(a) aiming the laser at a layer placed over a top surface of the substrate;
(b) absorbing energy from the laser into the layer;
(c) forming a first scribe line in a first direction in the layer by scanning the laser across the layer, the laser removing at least a portion of the layer;
(d) cutting a first kerf in the substrate with the saw blade along the first scribe line;
(e) forming a further first scribe line in the first direction over the substrate, the further scribe line substantially parallel to the first scribe line;
(f) cutting a further first kerf in the substrate with the saw blade along the further first scribe line;
(g) repeating steps (e) and (f) in the first direction until the entire substrate is scribed and cut;
(h) forming a second scribe line in a second direction in the layer by scanning the laser across the layer and removing at least a portion of the layer, the second direction substantially orthogonal to the first direction;
(i) cutting a second kerf in the substrate with the saw blade along the second scribe line;
(j) forming a further second scribe line in the second direction on the substrate, the further second scribe line substantially parallel to the second scribe line;
(k) cutting a further second kerf in the substrate with the saw blade along the further second scribe line; and
(l) repeating steps (j) and (k) in the second direction until the entire substrate is scribed and cut, wherein the layer has a first absorption coefficient and the substrate has a second absorption coefficient relative to a wavelength of the laser beam, the first absorption coefficient greater than the second absorption coefficient by about an order of magnitude, and the first kerf, the further first kerfs, the second kerf and the further second kerfs form a plurality of dice from the substrate.
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21. A method for dicing a semiconductor substrate comprising the steps of:
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(a) aiming a plurality of individual laser beams at a layer placed over a top surface of the substrate, the layer having a first absorption coefficient relative to a respective wavelength of the each of the plurality of laser beams;
(b) absorbing energy from the plurality of laser beams into the layer based on the first absorption coefficient;
(c) forming a respective first set of scribe lines for each of the plurality of lasers beams in a first direction in the layer by scanning the plurality of laser beams across the layer, the plurality of laser beams removing at least a portion of the layer;
(d) forming a respective second set of scribe lines in a second direction in the layer by scanning the plurality of laser beams across the layer and removing at least a portion of the layer,;
(e) cutting through the substrate along the second set of scribe lines with a saw blade to form a respective first set of kerfs; and
(f) cutting through the substrate along the first set of scribe lines with the saw blade to form a respective second set of kerfs, wherein the substrate has a second absorption coefficient relative to the wavelength of the laser beam, the second absorption coefficient less than the first absorption coefficient. - View Dependent Claims (22, 23, 24, 25, 28, 30, 31, 32)
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26. A method for dicing a semiconductor substrate comprising the steps of:
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(a) aiming a laser beam at a layer placed over a top surface of the substrate, the layer having a first absorption coefficient relative to a wavelength of the laser beam;
(b) absorbing energy from the laser beam into the layer based on the first absorption coefficient;
(c) forming a first set of scribe lines in a first direction in the layer by scanning the laser beam across the layer, the laser beam removing at least a portion of the layer;
(d) forming a second set of scribe lines in a second direction in the layer by scanning the laser beam across the layer and removing at least a portion of the layer with the laser beam, the second direction substantially orthogonal to the first direction, (e) cutting through the substrate along the second set of scribe lines with to form a respective first set of kerfs, each spindle holding and rotating a respective saw blade, and (f) cutting through the substrate along the first set of scribe lines with the two spindles to form a respective second set of kerfs, wherein the substrate has a second absorption coefficient relative to the wavelength of the laser beam, the second absorption coefficient less than the first absorption coefficient.
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27. A method for dicing a semiconductor substrate comprising the steps of:
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(a) aiming a plurality of individual laser beams at a layer placed over a top surface of the substrate, the layer having a first absorption coefficient relative to a respective wavelength of each of the plurality of laser beams;
(b) absorbing energy from the plurality of laser beams into the layer based on the first absorption coefficient;
(c) forming a respective first set of scribe lines for each of the plurality of lasers beams in a first direction in the layer by scanning the plurality of laser beams across the layer, the plurality of laser beams removing at least a portion of the layer;
(d) forming a respective second set of scribe lines in a second direction in the layer by scanning the plurality of laser beams across the layer and removing at least a portion of the layer with the plurality of laser beams;
(e) forming a respective first set of kerfs by cutting through the substrate along the second set of scribe lines with two spindles, each spindle holding and rotating a respective saw blade; and
(f) forming a respective second set of kerfs by cutting through the substrate along the first set of scribe lines with the two spindles each one holding and rotating a saw blade.
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29. An apparatus for dicing a semiconductor substrate having a coating layer thereon, the apparatus comprising:
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an infrared laser placed over the coating layer of the substrate, the coating layer having a first absorption coefficient relative to a wavelength of the laser and the semiconductor substrate having a second absorption coefficient less than the first absorption coefficient; and
a spindle mounted over a surface of the substrate, the spindle holding and rotating a saw blade, wherein energy from the laser beam is absorbed into the coating layer based on a first absorption coefficient to form at least one scribe line therein, and the saw blade cuts through the substrate along the at least one scribe line.
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33. An apparatus for dicing a semiconductor substrate having a coating layer thereon, the apparatus comprising:
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at least two infrared laser beams placed over the coating layer of the substrate, the coating layer having a first absorption coefficient relative to a wavelength of each of the at least two laser beams and the semiconductor substrate having a second absorption coefficient less than the first absorption coefficient; and
a spindle mounted over a surface of the substrate, the spindle holding and rotating a saw blade, wherein energy from the at least two laser beams is absorbed into respective portions of the coating layer based on a first absorption coefficient to form respective scribe lines therein, and the saw blade cuts through the substrate along the respective scribe lines. - View Dependent Claims (34, 35, 38, 39)
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36. An apparatus for dicing a semiconductor substrate having a coating layer thereon, the apparatus comprising:
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an infrared laser placed over the coating layer of the substrate, the coating layer having a first absorption coefficient relative to a wavelength of the laser and the semiconductor substrate having a second absorption coefficient less than the first absorption coefficient; and
at least two spindles mounted over a surface of the substrate, each spindle holding and rotating one saw blade, wherein energy from the laser beam is absorbed into the coating layer based on a first absorption coefficient to form a plurality of scribe lines therein, and the at least two saw blades separately cut through the substrate along respective ones of the plurality of scribe lines.
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37. An apparatus for dicing a semiconductor substrate having a coating layer thereon, the apparatus comprising:
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at least two infrared laser beams placed over the coating layer of the substrate, the coating layer having a first absorption coefficient relative to a wavelength of each of the at least two laser beams and the semiconductor substrate having a second absorption coefficient less than the first absorption coefficient; and
two spindles mounted over a surface of the substrate, each spindle holding and rotating one saw blade, wherein energy from the at least two laser beams is absorbed into the coating layer based on a first absorption coefficient to form a respective plurality of scribe lines therein, and the two dicing blades separately cut through the substrate along respective ones of the plurality of scribe lines.
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40. An apparatus for dicing a semiconductor substrate having a coating layer, the apparatus comprising:
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means for forming at first set of scribe lines in a first direction in the layer and removing at least a portion of the layer;
means for forming a second set of scribe lines in a second direction in the layer and removing at least a portion of the layer in a substantially orthogonal direction to the first set of scribe lines, means for cutting through the substrate along the second set of scribe lines to form a respective first set of kerfs, and means for cutting through the substrate along the first set of scribe lines to form a respective second set of kerfs, wherein the substrate has a second absorption coefficient relative to a wavelength of the forming means, the second absorption coefficient less than the first absorption coefficient by about an order of an order of magnitude.
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41. An apparatus for dicing a semiconductor substrate having a coating layer, the apparatus comprising:
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means for forming a first scribe line in a first direction in only the coating layer;
means for cutting a first kerf in the substrate along the first scribe line;
means for forming a further first scribe line in the first direction in only the coating layer, the further scribe line substantially parallel to the first scribe line;
means for cutting a further first kerf in the substrate along the further first scribe line;
means for forming a second scribe line in a second direction in only the coating layer, the second direction substantially orthogonal to the first direction;
means for cutting a second kerf in the substrate along the second scribe line;
means for forming a further second scribe line in only the coating layer in the second direction on the substrate, the further second scribe line substantially parallel to the second scribe line; and
means for cutting a further second kerf in the substrate along the further second scribe line;
wherein the coating layer has a first absorption coefficient and the substrate has a second absorption coefficient relative to a wavelength of the forming means, the first absorption coefficient greater than the second absorption coefficient by about an order of magnitude, and the first kerf, the further first kerfs, the second kerf and the further second kerfs form a plurality of dice from the substrate.
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42. An system for dicing a semiconductor substrate having a coating layer, the system comprising:
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a scribing apparatus including;
i) means for forming at first set of scribe lines in a first direction in the layer and removing at least a portion of the layer; and
ii) means for forming a second set of scribe lines in a second direction in the layer and removing at least a portion of the layer in a substantially orthogonal direction to the first set of scribe lines, and a dicing apparatus including;
i) means for cutting through the substrate along the second set of scribe lines to form a respective first set of kerfs, and ii) means for cutting through the substrate along the first set of scribe lines to form a respective second set of kerfs, wherein the substrate has a second absorption coefficient relative to a wavelength of the forming means, the second absorption coefficient less than the first absorption coefficient by about an order of an order of magnitude.
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43. An system for dicing a semiconductor substrate having a coating layer thereon, the system comprising:
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an infrared laser placed over the coating layer of the substrate, the coating layer having a first absorption coefficient relative to a wavelength of the laser and the semiconductor substrate having a second absorption coefficient less than the first absorption coefficient; and
a spindle mounted over a surface of the substrate, the spindle holding and rotating a saw blade, wherein energy from the laser beam is absorbed into the coating layer based on a first absorption coefficient to form at least one scribe line therein, and the saw blade cuts through the substrate along the at least one scribe line. - View Dependent Claims (44)
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Specification