• US 20020034834A1
  • Filed: 06/15/1999
  • Published: 03/21/2002
  • Est. Priority Date: 01/06/1998
  • Status: Active Grant
First Claim
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1. An optoelectronic assembly comprising:

  • a) an active optical device having a first optical axis;

    b) an insulating substrate with a planar surface;

    c) a metal layer bonded to said planar surface such that selected regions of said insulating substrate are exposed and a step is produced between said insulating substrate and a top surface of said metal layer, said active optical device being mounted on said metal layer such that said first optical axis is parallel to said insulating substrate, said metal layer further providing an electrical path to said active optical device and having a predetermined thickness such that;

    i) heat generated by said active optical device is dissipated;

    ii) said insulating substrate does not interfere with the propagation of light along said first optical axis; and

    iii) the in-plane coefficient of thermal expansion (CTE) of said metal layer is constrained by said insulating substrate.

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