Printed wiring board for semiconductor plastic package
First Claim
1. A printed wiring board for a semiconductor plastic package, which printed wiring board has, a double-side copper-clad laminate formed of an insulation layer having a thickness of 0.2 mm or less and having copper foils on both surfaces, one copper foil on one surface and one copper foil on the other surface, wherein the double-side copper-clad laminate has an upper copper foil surface and a lower copper foil surface, the upper copper foil surface has a wire bonding or flip chip bonding terminal for connecting a terminal of a semiconductor chip to said substrate, and has a copper pad in a position where the copper pad can be electrically connected to said wire bonding or flip chip bonding terminal and can be connected to a blind via hole formed in the lower copper surface, the lower copper foil surface has a solder-balls-fixing pad in a position corresponding to said copper pad, the solder-balls-fixing pad has at least 2 blind via holes within itself, and the solder-balls-fixing pad connected to a reverse surface of the copper pad with a conductive material is electrically connected to a conductive material with solder balls which are melted and filled in blind via holes so as to be mounded.
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Accused Products
Abstract
Provided is a printed wiring board for a chip size scale package, which overcomes the poor adhesion of solder balls to a base material which poor adhesion is caused by a recent decrease in the size of the solder balls, and in the chip size scale package, the distortion of the printed wiring board is decreased and the distortion of a semiconductor plastic package formed by mounting a semiconductor chip on the printed wiring board by wire bonding or flip chip bonding is decreased. The printed wiring board has, as a substrate for a chip scale package, a double-side copper-clad laminate formed of an insulation layer and having copper foils on both surfaces,
wherein the double-side copper-clad laminate has an upper copper foil surface and a lower copper foil surface,
the upper copper foil surface has a wire bonding or flip chip bonding terminal and has a copper pad in a position where the copper pad can be electrically connected to said wire bonding or flip chip bonding terminal and can be connected to a blind via hole formed in the lower copper surface,
the lower copper foil surface has a solder-balls-fixing pad in a position corresponding to said copper pad,
the solder-balls-fixing pad has at least 2 blind via holes within itself, and
the solder-balls-fixing pad connected to a reverse surface of the copper pad with a conductive material is electrically connected with solder balls which are melted and filled in blind via holes so as to be mounded.
12 Citations
14 Claims
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1. A printed wiring board for a semiconductor plastic package, which printed wiring board has, a double-side copper-clad laminate formed of an insulation layer having a thickness of 0.2 mm or less and having copper foils on both surfaces, one copper foil on one surface and one copper foil on the other surface,
wherein the double-side copper-clad laminate has an upper copper foil surface and a lower copper foil surface, the upper copper foil surface has a wire bonding or flip chip bonding terminal for connecting a terminal of a semiconductor chip to said substrate, and has a copper pad in a position where the copper pad can be electrically connected to said wire bonding or flip chip bonding terminal and can be connected to a blind via hole formed in the lower copper surface, the lower copper foil surface has a solder-balls-fixing pad in a position corresponding to said copper pad, the solder-balls-fixing pad has at least 2 blind via holes within itself, and the solder-balls-fixing pad connected to a reverse surface of the copper pad with a conductive material is electrically connected to a conductive material with solder balls which are melted and filled in blind via holes so as to be mounded.
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8. A printed wiring board for a semiconductor plastic package, which printed wiring board is formed by providing a copper-clad laminate formed of copper foils and a base material of a 150 μ
- m to 40 μ
m thick glass fabric impregnated with a thermosetting resin composition, one copper foil on one surface of the substrate and one copper foil on the other surface of the substrate, arranging at least a semiconductor chip bonding terminal, a solder ball connecting pad, a copper foil circuit for connecting a bonding terminal and said pad and a through hole conductive material in the copper-clad laminate to form a circuit board, then, stacking prepreg sheets of glass fabric base material/thermosetting resin on the entire front and reverse surfaces, laminating the resultant set under pressure and under heat, and then removing base material formed of the glass fabric and the thermosetting resin composition on at least part of the surface of the bonding terminal and on at least part of the surface of the solder balls connecting pad, to expose a circuit. - View Dependent Claims (9, 10, 11, 12, 13, 14)
- m to 40 μ
Specification