Semiconductor device

  • US 20020053727A1
  • Filed: 08/29/2001
  • Published: 05/09/2002
  • Est. Priority Date: 08/31/2000
  • Status: Active Grant
First Claim
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1. A semiconductor device having a substrate on which a plurality of semiconductor chips are stacked to each other, wherein said semiconductor device comprising;

  • a first semiconductor chip mounted on said substrate, a plurality of second semiconductor chips size of which are larger than that of said first semiconductor chip and stacked on said first semiconductor chip with a size-increasing order, a bonding pad formed on said semiconductor chip, a circuit pattern formed on said substrate, a bonding wire for connecting said bonding pad formed on said semiconductor chip and said circuit pattern formed on said substrate, a through hole, formed on said substrate, through which said bonding wire is to be inserted, and further wherein said bonding wire is wired so as to be substantially perpendicularly to a surface of said semiconductor chip.

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