MEMS enclosure
First Claim
1. A MEMS device package comprising:
- a plastic case with an O-ring-seal flange;
a printed circuit board base in said plastic case;
an O-ring seal on said flange;
a window on said O-ring seal; and
a window retaining ring connected to said case and pressing said window to said O-ring.
1 Assignment
0 Petitions
Accused Products
Abstract
A low-cost, high-performance, reliable micromirror package (300) that replaces the ceramic substrate in conventional packages with a printed circuit board substrate (30) and a molded plastic case (33), and the cover glass with a window (36), preferably an optically clear plastic window. The printed circuit board substrate (30) allows for either external bond pads or flex cable connection of the micromirror package to the projector'"'"'s motherboard. These packages support flexible snap-in, screw-in, ultrasonic plastic welding, or adhesive welding processes to overcome the high cost seam welding process of many conventional packages.
14 Citations
23 Claims
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1. A MEMS device package comprising:
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a plastic case with an O-ring-seal flange;
a printed circuit board base in said plastic case;
an O-ring seal on said flange;
a window on said O-ring seal; and
a window retaining ring connected to said case and pressing said window to said O-ring. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of packaging a MEMS device, the method comprising the steps of:
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attaching a MEMS device to a printed circuit board base;
bonding pads on said MEMS device to pads on said printed circuit board base;
placing an O-ring on an O-ring-seal flange of a plastic case;
placing a plastic window on top of said O-ring;
placing a snap-on window retaining ring on top of and around the perimeter of said window; and
compressing said snap-on window retaining ring, window, and O-ring until said snap-on retaining ring hooks lock into snap-slots located in said plastic case.
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11. A MEMS package comprising:
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a plastic case with an adhesive-seal flange;
a printed circuit board base in said plastic case and;
a window bonded to said adhesive-seal flange. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 21)
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19. A method of packaging a micromirror, said method comprising the steps of:
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attaching a micromirror to a printed circuit board base;
bonding micromirror pads to printed circuit board base pads;
placing said printed circuit board in a plastic case;
dispensing adhesive onto an adhesive-seal flange on said plastic case;
placing a window on top of said adhesive; and
curing said adhesive.
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20. A micromirror projection display comprising:
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a light source for providing a beam of light along a light path;
a first condenser lens on said light path for receiving said beam of light;
a filter assembly on said light path for receiving and filtering said beam of light from said first condenser lens;
a second condenser lens for receiving said filtered beam of light;
a micromirror mounted in a low-cost molded plastic package with built-in printed circuit board base and window for selectively modulating said filtered beam of light; and
a projection lens for receiving said modulated beam of light and focusing said modulated beam of light on an image plane.
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22. A high-brightness micromirror projection display comprising:
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a light source for providing a beam of light along a light path;
a first condenser lens on said light path for receiving said beam of light;
a total internal reflective prism receiving said beam of light;
a color-splitting prism assembly receiving said. beam of light from said total internal reflective prism;
three micromirrors mounted in a low-cost molded plastic packages with built-in printed circuit board bases and windows for selectively modulating said filtered beam of light; and
a projection lens for receiving said modulated beam of light and focusing said modulated beam of light on an image plane. - View Dependent Claims (23)
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Specification