Alignment mark system for mass transport processes

• US 20020063974A1
• Filed: 11/29/2000
• Published: 05/30/2002
• Est. Priority Date: 11/29/2000
• Status: Active Grant

• Current Assignee: Axsun Technologies Incorporated
• Original Assignee: Axsun Technologies Incorporated
• Inventors: Liau, Zong Long, Stern, Margaret B.
• Granted Patent: US 6,731,438 B2
• Time in Patent Office: Days
• US Class Current: 359/804
• CPC Class Codes: G03F 9/7076 Mark details, e.g. phase grating mark, temporary mark
• CPC Class Codes: H01L 21/681 using optical controlling means
• CPC Class Codes: H01L 2223/54453 for use prior to dicing
• CPC Class Codes: H01L 2223/5446 Located in scribe lines
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A technique for creating alignment feature in mass transported substrates yields alignment features that can be located with high degrees of accuracy. Specifically, structures such as concave or convex lenses are created that yield a light pattern in transmission or reflection when the part of the substrate is imaged or a plane near the substrate is imaged. This light pattern is then used to align the substrate during subsequent lithography or packaging processes.

Claims

1. A mass transported alignment mark system, comprising:

a substrate that has been subjected to a mass transport process; and

a lens alignment structure formed on the substrate that yields a light pattern when the substrate or a plane near the substrate is imaged.

2. An alignment mark system as claimed in claim 1, wherein the substrate is gallium phosphide.

3. An alignment mark system as claimed in claim 1, wherein the substrate is silicon.

4. An alignment mark system as claimed in claim 1, further comprising a metal layer that is aligned to the light pattern from the lens structure.

5. An alignment mark system as claimed in claim 4, wherein the metal layer is used in a metal bonding process.

6. An alignment mark system as claimed in claim 5, wherein the metal layer comprises alignment marks that are used the metal bonding process.

7. An alignment mark system as claimed in claim 4, wherein the metal layer is used in a solder bonding process.

8. An alignment mark system as claimed in claim 7, wherein the metal layer comprises alignment marks that are aligned to the light pattern.

9. An alignment mark system as claimed in claim 1, wherein the lens alignment structure comprises a concave lens.

10. An alignment mark system as claimed in claim 1, wherein the lens alignment structure comprises a cylindrical lens.

11. An alignment mark system as claimed in claim 1, wherein the lens alignment structure comprises a concave cylindrical lens.

12. An alignment mark system as claimed in claim 1, wherein the lens alignment structure comprises multiple concave cylindrical lenses.

13. An alignment mark system as claimed in claim 1, wherein the lens alignment structure comprises multiple concave cylindrical lenses, as least two of the cylindrical lenses being arranged orthogonally with respect to each other.

15. An alignment mark system as claimed in claim 14, wherein the substrate is gallium phosphide.

16. An alignment mark system as claimed in claim 14, wherein the substrate is silicon.

17. An alignment mark system as claimed in claim 14, further comprising a metal layer that is aligned to the light pattern from the lens structure.

18. An alignment mark system as claimed in claim 17, wherein the metal layer is used in a metal bonding process.

19. An alignment mark system as claimed in claim 18, wherein the metal layer comprises alignment marks that are aligned to the an alignment feature generated by the lens alignment structure.

20. An alignment mark system as claimed in claim 17, wherein the metal layer is used in a solder bonding process.

21. An alignment mark system as claimed in claim 20, wherein the metal layer comprises alignment marks that are aligned to the an alignment feature generated by the lens alignment structure.

22. An alignment mark system as claimed in claim 14, wherein the lens alignment structure comprises a concave lens.

23. An alignment mark system as claimed in claim 14, wherein the lens alignment structure comprises a cylindrical lens.

24. An alignment mark system as claimed in claim 14, wherein the lens alignment structure comprises a concave cylindrical lens.

25. An alignment mark system as claimed in claim 14, wherein the lens alignment structure comprises multiple concave cylindrical lenses.

26. An alignment mark system as claimed in claim 14, wherein the lens alignment structure comprises multiple concave cylindrical lenses, as least two of the cylindrical lenses being arranged orthogonally with respect to each other.

14. An alignment mark system, comprising:

a substrate; and

a lens alignment structure formed in the substrate that has a focal point in the substrate or near a surface of the substrate.