Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
First Claim
Patent Images
1. A semiconductor device comprising:
- a substrate in which penetrating holes are formed;
a semiconductor chip having electrodes;
a conductive member adhered on one side of said substrate by an adhesive material over a particular region of said one side including said penetrating holes, and electrically connected to said electrodes of said semiconductor chip on the side opposite to the surface of being adhered by said adhesive; and
external electrodes which are provided through said penetrating holes, electrically connected to said conductive member, and extending as far as outside of the other side of said substrate;
wherein a part of said adhesive material is interposed between internal wall surfaces forming said penetrating holes and said external electrodes within said penetrating holes.
0 Assignments
0 Petitions
Accused Products
Abstract
The semiconductor device comprises an insulating film in which penetrating holes are formed, a semiconductor chip having electrodes, a wiring pattern adhered by an adhesive over a region including penetrating holes on one side of the insulating film and electrically connected to the electrodes of the semiconductor chip, and external electrodes provided on the wiring pattern through the penetrating holes and projecting from the surface opposite to the surface of the substrate on which the wiring pattern is formed. Part of the adhesive is drawn in to be interposed between the penetrating holes and external electrodes.
11 Citations
52 Claims
-
1. A semiconductor device comprising:
-
a substrate in which penetrating holes are formed;
a semiconductor chip having electrodes;
a conductive member adhered on one side of said substrate by an adhesive material over a particular region of said one side including said penetrating holes, and electrically connected to said electrodes of said semiconductor chip on the side opposite to the surface of being adhered by said adhesive; and
external electrodes which are provided through said penetrating holes, electrically connected to said conductive member, and extending as far as outside of the other side of said substrate;
wherein a part of said adhesive material is interposed between internal wall surfaces forming said penetrating holes and said external electrodes within said penetrating holes. - View Dependent Claims (2, 4, 7, 10, 13, 16, 19, 22, 25, 28, 29, 30)
-
-
3. A semiconductor device comprising:
-
a substrate in which penetrating holes are formed;
a semiconductor chip having electrodes;
a conductive member directly formed over a particular region including said penetrating holes on one side of said substrate, and electrically connected to said electrodes of said semiconductor chip; and
external electrodes which are provided through said penetrating holes, electrically connected to said conductive member, and extending as far as outside of the other side of said substrate;
wherein said substrate is formed of a material of a higher elasticity than said external electrodes; and
wherein protrusions are formed in the internal wall surfaces of said penetrating holes by said material constituting said substrate. - View Dependent Claims (5, 8, 11, 14, 17, 20, 23, 26)
-
-
6. A semiconductor device comprising:
-
a substrate in which penetrating holes are formed;
a semiconductor chip having electrodes;
a conductive member adhered on one side of said substrate by an adhesive material over a particular region of said one side including said penetrating holes, and electrically connected to said electrodes of said semiconductor chip on the side opposite to the surface of being adhered by said adhesive; and
external electrodes which are provided through said penetrating holes, electrically connected to said conductive member, and extending as far as outside of the other side of said substrate;
wherein each of said external electrodes includes a base portion positioned within each of said penetrating holes and a projecting portion projecting from each of said penetrating holes, the diameter d of said base portion being related to the diameter φ
of said projecting portion by φ
≦
d. - View Dependent Claims (9, 12, 15, 18, 21, 24, 27)
-
-
31. A method of manufacturing a semiconductor device, comprising:
-
a step of providing a substrate with an adhesive material provided on one surface thereof;
a step of carrying out punching from the side of said substrate on which said adhesive material is provided, and in the direction of the opposite side thereof, whereby penetrating holes are formed and a part of said adhesive material is drawn into said penetrating holes;
a step of adhering a conductive member over a particular region on said one surface including said penetrating holes on said substrate through said adhesive material;
a step of providing a material for forming external electrodes on said conductive member, and forming external electrodes through said penetrating holes and the inner side of said part of adhesive material drawn into the penetrating holes to project from the surface opposite to the surface of said substrate on which said conductive member is formed; and
a step of electrically connecting electrodes of a semiconductor chip to said conductive member. - View Dependent Claims (36, 39, 41, 44, 47, 50)
-
-
32. A method of manufacturing a semiconductor device, comprising:
-
a step of providing a substrate of a material of a higher elasticity than external electrodes, having penetrating holes in which the internal wall surfaces have protrusions, and having a conductive member directly formed over a region including said penetrating holes;
a step of providing a material for forming external electrodes on said conductive member, and forming external electrodes through said penetrating holes to project from the surface opposite to the surface of said substrate on which said conductive member is formed; and
a step of electrically connecting electrodes of a semiconductor chip to said conductive member. - View Dependent Claims (33, 34, 35, 37, 40, 42, 43, 45, 46, 48, 49, 51, 52)
-
-
38. A method of manufacturing a semiconductor device, comprising:
-
a step of providing a substrate in which penetrating holes are formed and a conductive member is formed over a region including said penetrating holes;
a step of providing a material for forming external electrodes on said conductive member, and forming external electrodes through said penetrating holes to project from the surface opposite to the surface of said substrate on which said conductive member is formed; and
a step of electrically connecting electrodes of a semiconductor chip to said conductive member;
wherein each of said external electrodes includes a base portion positioned within each of said penetrating holes and a projecting portion projecting from each of said penetrating holes, the diameter d of said base portion being related to the diameter φ
of said projecting portion by φ
≦
d.
-
Specification