Plasma etching apparatus with focus ring and plasma etching method

  • US 20020072240A1
  • Filed: 11/07/2001
  • Published: 06/13/2002
  • Est. Priority Date: 12/07/2000
  • Status: Active Grant
First Claim
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1. A plasma etching apparatus comprising:

  • a lower electrode supporting a semiconductor substrate;

    a focus ring disposed along a circumference of said semiconductor substrate;

    a sensor for measuring a position of an upper surface of said focus ring;

    a drive mechanism for driving said focus ring vertically; and

    a controller for adjusting the position of the upper surface of said focus ring by driving said drive mechanism on the basis of a result of measurement by said sensor.

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