Liquid epoxy resin composition and semiconductor device

  • US 20020077421A1
  • Filed: 09/20/2001
  • Published: 06/20/2002
  • Est. Priority Date: 09/22/2000
  • Status: Active Grant
First Claim
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1. A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler, said curing agent (B) comprising 5 to 75 parts by weight of a mixture of 3,4-dimethyl-6-(2-methyl-1-propenyl)-1,2,3,6-tetrahydrophthalic acid and 1-isopropyl-4-methyl-bicyclo[2.2.2]oct-5-ene-2,3-dicarboxylic acid per 100 parts by weight of the entire curing agent.

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