Light emitting semiconductor package
First Claim
Patent Images
1. An light emitting semiconductor package including:
- a) a semiconductor chip having a top surface and a bottom surface and having at least one light emitting device formed in the chip which emits electromagnetic radiation at one or more wavelengths from the top surface;
b) a first hollow cap having a central portion and a first perimeter wall extending from the perimeter edge of the central portion with the free edge of the first perimeter wall bonded to the top surface to provide a first cavity and which, in plan view, overlays part or all of at least one light emitting device, said central portion including at least one region which is at least substantially transparent or translucent to electromagnetic radiation at said one or more wavelengths; and
wherein the first cap has been bonded to the semiconductor chip at the wafer stage prior to separation of the wafer into individual packages.
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Abstract
A light emitting semiconductor package (250) has a semiconductor chip (252) with a surface with one or more light emitting devices (254) formed on or in the surface. A cap (256) is bonded to the surface of the chip (252) to encapsulate the devices (254). The cap has one or more regions (258) transparent to light emitted by the light emitting devices (254). The cap has been bonded to the semiconductor chip (252) at the wafer stage prior to separation of the wafer into individual packages.
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Citations
7 Claims
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1. An light emitting semiconductor package including:
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a) a semiconductor chip having a top surface and a bottom surface and having at least one light emitting device formed in the chip which emits electromagnetic radiation at one or more wavelengths from the top surface;
b) a first hollow cap having a central portion and a first perimeter wall extending from the perimeter edge of the central portion with the free edge of the first perimeter wall bonded to the top surface to provide a first cavity and which, in plan view, overlays part or all of at least one light emitting device, said central portion including at least one region which is at least substantially transparent or translucent to electromagnetic radiation at said one or more wavelengths; and
wherein the first cap has been bonded to the semiconductor chip at the wafer stage prior to separation of the wafer into individual packages. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification