Composition for polishing semiconductor wafer, semiconductor circuit wafer, and method for producing the same
First Claim
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1. A polishing composition for polishing copper and tantalum or a tantalum compound provided on a semiconductor wafer, comprising an aqueous solvent and at least one amino acid having two or more nitrogen atoms.
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Abstract
A polishing composition for polishing copper and tantalum or a tantalum compound provided on a semiconductor wafer, including an aqueous solvent and at least one amino acid having two or more nitrogen atoms.
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26 Claims
- 1. A polishing composition for polishing copper and tantalum or a tantalum compound provided on a semiconductor wafer, comprising an aqueous solvent and at least one amino acid having two or more nitrogen atoms.
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25. A semiconductor wiring wafer comprising copper wiring and a diffusion barrier layer formed from tantalum or a tantalum compound, produced by contacting a semiconductor wafer with a polishing pad, feeding a polishing composition comprising aqueous solvent and at least one amino acid having two or more nitrogen atoms between the semiconductor wafer and the polishing pad, and polishing the wafer.
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26. A method for producing a semiconductor wiring wafer which comprises forming copper wiring and a diffusion barrier layer of tantalum or a tantalum compound on a semiconductor wafer, contacting the semiconductor wafer with a polishing pad;
- feeding a polishing composition comprising aqueous solvent and at least one amino acid having two or more nitrogen atoms between the semiconductor wafer and the polishing pad; and
polishing the wafer.
- feeding a polishing composition comprising aqueous solvent and at least one amino acid having two or more nitrogen atoms between the semiconductor wafer and the polishing pad; and
Specification