Thin-film semiconductor device and method of manufacturing the same
First Claim
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1. A method of manufacturing a thin-film semiconductor device, comprising:
- the step of preparing a member having a semiconductor film with a semiconductor element and/or semiconductor integrated circuit on a separation layer;
the separation step of separating the member at the separation layer by a pressure of a fluid; and
the chip forming step of, after the separation step, forming the semiconductor film into chips.
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Abstract
A thin-film semiconductor device with a reduced influence on a device formation layer in separation and a method of manufacturing the device are provided. The manufacturing method includes the step of preparing a member having a semiconductor film with a semiconductor element and/or semiconductor integrated circuit on a separation layer, the separation step of separating the member at the separation layer by a pressure of a fluid, and the chip forming step of, after the separation step, forming the semiconductor film into chips.
99 Citations
12 Claims
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1. A method of manufacturing a thin-film semiconductor device, comprising:
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the step of preparing a member having a semiconductor film with a semiconductor element and/or semiconductor integrated circuit on a separation layer;
the separation step of separating the member at the separation layer by a pressure of a fluid; and
the chip forming step of, after the separation step, forming the semiconductor film into chips. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of manufacturing a thin-film semiconductor device, comprising:
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the step of preparing a member having a semiconductor film with a semiconductor element and/or semiconductor integrated circuit on a separation layer;
the chip forming step of forming the member into chips in desired regions; and
the separation step of, after the chip forming step, separating the member at the separation layer.
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11. A thin-film semiconductor device obtaining by processing a member having a semiconductor film with a semiconductor element and/or semiconductor integrated circuit on a separation layer, the process comprising:
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the separation step of separating the member at the separation layer by a pressure of a fluid; and
the chip forming step of, after the separation step, forming the semiconductor film into chips.
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12. A thin-film semiconductor device obtaining by processing a member having a semiconductor film with a semiconductor element and/or semiconductor integrated circuit on a separation layer, the process comprising:
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the chip forming step of forming the member into chips in desired regions; and
the separation step of, after the chip forming step, separating the member at the separation layer.
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Specification