Rectifying device and method of fabrication thereof

  • US 20020109201A1
  • Filed: 02/09/2001
  • Published: 08/15/2002
  • Est. Priority Date: 02/09/2001
  • Status: Abandoned Application
First Claim
Patent Images

1. A rectifying device comprising:

  • a silicon die with a metal film plated on either surface thereof;

    a pair of molybdenum layers each sized to be substantially the same as the silicon die, each molybdenum layer being coupled to the surface of the silicon die with the metal film plated thereon by brazing each metal film between the silicon die and each molybdenum layer for forming the silicon die and the molybdenum layers together; and

    a glass layer formed by sintering a glass paste onto the peripheral surface of the silicon die.

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