Configuration to multiplex and/or demultiplex the signals of a plurality of optical data channels and method for the production of the configuration

• US 20020110316A1
• Filed: 02/15/2001
• Published: 08/15/2002
• Est. Priority Date: 02/15/2001
• Status: Active Grant

• Current Assignee: II-VI Delaware, Inc. (Coherent Corp.)
• Original Assignee: Infineon Technologies AG
• Inventors: Kropp, Jorg-Reinhardt
• Granted Patent: US 6,574,390 B2
• Time in Patent Office: Days
• US Class Current: 385/24
• CPC Class Codes: G02B 6/29368 Light guide comprising the filter, e.g. filter deposited on a fibre end G02B6/29359 takes precedence
• CPC Class Codes: G02B 6/2938 for multiplexing or demultiplexing, i.e. combining or separating wavelengths, e.g. 1xN, NxM
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence

Abstract

The invention relates to an arrangement for multiplexing and/or demultiplexing the signals of a plurality of optical data channels of different wavelength, in which the multiplexed signals are transmitted in a waveguide (1). According to the invention, the waveguide (1) is disposed or embodied in a planar substrate (2), which has a plurality of cutouts (3) extending at a defined angle, which interrupt the waveguide (1) at successive points, and one wavelength-selective mirror (4) is disposed in each of these cutouts (3), at which mirror light is coupled in or out obliquely to the surface of the substrate (2). The invention further relates to a method for producing such an arrangement.

Claims

1. An arrangement for multiplexing and/or demultiplexing the signals of a plurality of optical data channels of different wavelength, in which the multiplexed signals are transmitted in a waveguide (1),

characterized in that

the waveguide (1) is disposed or embodied in a planar substrate (2), which has a plurality of cutouts (3) extending at a defined angle, which interrupt the waveguide (1) at successive points, and one wavelength-selective mirror (4) is disposed in each of these cutouts (3), at which mirror light is coupled in or out obliquely to the surface of the substrate (2).

2. The arrangement of claim 1, characterized in that the cutouts (3) all have the same angle relative to the substrate surface.

3. A method of claim 1 or 2, characterized in that the mirrors (4) are positioned in the cutouts (3) via an adhesive that has the same coefficient of diffraction as, or a similar coefficient of diffraction to, the waveguide (1) of the substrate (2).

4. The arrangement of at least one of the foregoing claims, characterized in that the waveguide (1) is embodied as optically integrated or in the form of a fiber.

5. The arrangement of at least one of the foregoing claims, characterized in that the waveguide (1) comprises glass or a plastic.

6. The arrangement of at least one of claims 1-5, characterized in that the waveguide (1) comprises semiconductor material.

7. The arrangement of at least one of the foregoing claims, characterized in that the waveguide (1) is a many-mode waveguide.

8. The arrangement of at least one of the foregoing claims, characterized in that semiconductor materials are used as wavelength-selective mirrors (4).

9. The arrangement of at least one of the foregoing claims, characterized in that the light coupled in or out via the wavelength-selective mirrors (4) is coupled in each case with a transmitter or receiver unit (5) that is disposed directly on the substrate (2).

10. The arrangement of at least one of the foregoing claims, characterized in that guide structures (9), in particular for attaching optical waveguides (7), are integrated with the substrate (2).

11. The arrangement of claim 10, characterized in that the guide structures (9) are created by anisotropic etching.

12. The arrangement of at least one of the foregoing claims, characterized in that the waveguide (1) extends near the substrate edge (21).

13. The arrangement of at least one of the foregoing claims, characterized in that silicon is used as the substrate (2).

14. The arrangement of at least one of the foregoing claims, characterized in that a plastic is used as the substrate (2).

15. A method for producing the arrangement of claim 1,

characterized in that

cutouts (3) are made at a defined angle into a planar substrate (2), and wavelength-selective mirrors (4) are placed in the cutouts (3), and the waveguides (1) are cut apart at a plurality of successive points.

16. The method of claim 15, characterized in that the wavelength-selective mirrors (4) are positioned in the cutouts (3) by means of an adhesive.

17. The method of claim 15 or 16, characterized in that the cutouts are made in the form of lateral cutouts into the substrate (2).

18. The method of claim 17, characterized in that the cutouts (3) are made by means of a wafer saw.

19. The method of claim 18, characterized in that the surface of the cutouts (3) is smoothed chemically.

20. The method of at least one of claims 15-17, characterized in that the cutouts (3) are embodied by etching of the substrate (2).