Semiconductor wafer with process control modules

  • US 20020117735A1
  • Filed: 02/21/2002
  • Published: 08/29/2002
  • Est. Priority Date: 02/27/2001
  • Status: Active Grant
First Claim
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1. A semiconductor wafer (1) having a multitude of chips (5), of which chips (5) each one of a given number of chips (5) is situated in one of a multitude of adjacent exposure fields (2), and having process control modules (4) which are each arranged in a given area on the semiconductor wafer (1), in which the given areas are formed by the exposure fields (2), and in which each process control module (4) takes the place of at least one chip (5).

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