Tamper evident smart label with RF transponder

• US 20020135481A1
• Filed: 03/06/2002
• Published: 09/26/2002
• Est. Priority Date: 03/06/2001
• Status: Active Grant

• Current Assignee: Intermec IP Corporation (Honeywell International Inc.)
• Original Assignee: Intermec IP Corporation (Honeywell International Inc.)
• Inventors: Adams, Matt, Conwell, Kevin Girard
• Granted Patent: US 7,095,324 B2
• Time in Patent Office: Days
• US Class Current: 340/572.1
• CPC Class Codes: G06K 19/073 Special arrangements for circuits, e.g. for protecting identification code in memory protection against unauthorised use of computer memory G06F12/14
• CPC Class Codes: G06K 19/0739 the incapacitated circuit being part of an antenna
• CPC Class Codes: G08B 13/2417 having a radio frequency identification chip
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags
• CPC Class Codes: G08B 13/2448 Tag with at least dual detection means, e.g. combined inductive and ferromagnetic tags, dual frequencies within a single technology, tampering detection or signalling means on the tag
• CPC Class Codes: G08B 29/046 prevention of tampering with detection circuits

Abstract

A tamper evident smart label with an RFID or RF transponder. Use of tamper evident label materials in the layered construction of the smart label prevents removal, transferal, replacement and or alteration of the smart label without noticeable evidence of tampering. Propagation cuts in the RF Transponder substrate, adhesive that separates into visible patterns, holograms and or microprinting may be used to increase label tampering visibility.

Claims

1. A tamper evident RFID tag, comprising:

a tamper evident label material, with

an adhesive on a back side, and

an RFID Transponder adhered to said adhesive.

2. The tag of claim 1, wherein:

the tamper evident label material is a vinyl with a tensile and tear resistance such that the tamper evident label material one of tears and breaks upon an attempted removal from a substrate.

3. The tag of claim 1, wherein:

the tamper evident label material is 3M 7610 ScotchMark Destructible Vinyl.

4. The tag of claim 1, further including:

a release liner attached to said adhesive.

5. The tag of claim 1, further including:

a hologram on the label material.

6. The tag of claim 1, further including:

microprinting on the label material.

7. A tamper evident RFID tag, comprising

a label material, with

a silicone pattern and

an adhesive on a back side, and

an RF transponder adhered to said adhesive;

wherein separation of the tag from a substrate results in incomplete separation of the adhesive in the form of the silicone pattern.

8. The tag of claim 7, wherein:

the tamper evident label material is one of 3M 7866, 3M 7389 and 3M 7385.

9. The tag of claim 8, further including:

a hologram on the label material.

10. The tag of claim 9, further including:

microprinting on the label material.

11. A tamper evident RF transponder, comprising

a base film with a printed antenna and an integrated circuit chip on a front surface;

the base film having propagation tear cuts whereby attempted removal of the RF transponder from a substrate causes the propogation tear cuts to sever a connection between the printed antenna and the integrated circuit chip.

13. The method of claim 12, further including the step of:

applying a release liner to the adhesive.

12. A method of fabricating a tamper evident RFID tag, comprising the steps of:

applying an adhesive to a back side of a tamper evident material,

attaching an RF transponder to the adhesive.