Heat dissipation system for high power LED lighting system

• US 20020141197A1
• Filed: 03/29/2001
• Published: 10/03/2002
• Est. Priority Date: 03/29/2001
• Status: Active Grant

• Current Assignee: Consumer Lighting, LLC (d/b/a GE Lighting) (Savant Systems, LLC)
• Original Assignee: Gelcore (General Electric Company)
• Inventors: Petroski, James T.
• Granted Patent: US 6,481,874 B2
• Time in Patent Office: Days
• US Class Current: 362/373
• CPC Class Codes: F21L 4/027 the light sources being a LED
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/713 in direct thermal and mechanical contact of each other to form a single system
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

A high power LED lamp device includes a high power LED, a die for supplying electrical power to the LED, a heat sink secured to the die, and a housing between the heat sink and an external environment. Heat within the die is conducted to the heat sink. The housing conducts the heat received from the heat sink to the external environment.

Claims

1. A heat dissipating system for an LED lighting device, comprising:

an LED;

a die for supplying electrical power to the LED;

a thermally conductive material secured to the die, heat within the die being conducted to the thermally conductive material; and

an outer body around the thermally conductive material, the heat being transferred from the thermally conductive material to an external environment via the outer body.

2. The heat dissipating system for an LED lighting device as set forth in claim 1, further including:

a die support between the die and the thermally conductive material, the heat within the die being transferred to the thermally conductive material via the die support.

3. The heat dissipating system for an LED lighting device as set forth in claim 1, wherein the thermally conductive material includes a metal material.

4. The heat dissipating system for an LED lighting device as set forth in claim 3, wherein the thermally conductive material is a one-piece casing of the metal material.

5. The heat dissipating system for an LED lighting device as set forth in claim 1, wherein the thermally conductive material is a sleeve assembly.

6. The heat dissipating system for an LED lighting device as set forth in claim 1, further including:

a circuit board secured to the conductive material.

7. The heat dissipating system for an LED lighting device as set forth in claim 1, wherein the heat is transferred from the thermally conductive material to the outer body via conduction.

8. The heat dissipating system for an LED lighting device as set forth in claim 7, wherein the heat is transferred from outer body to the external environment via convection.

9. The heat dissipating system for an LED lighting device as set forth in claim 1, wherein the heat is transferred from the thermally conductive material to the outer body via a contact between the conductive material and the outer body.

10. The heat dissipating system for an LED lighting device as set forth in claim 1, further including:

a thermally conductive adhesive between the conductive material and the outer body, the heat being transferred from the thermally conductive material to the outer body via the thermally conductive adhesive.

11. A high power LED lamp device, comprising:

a high power LED;

a die for supplying electrical power to the LED;

a heat sink secured to the die, heat within the die being conducted to the heat sink; and

a housing between the heat sink and an external environment, the housing conducting the heat received from the heat sink to the external environment.

12. The high power LED lamp device as set forth in claim 11, further including:

a die attachment structure secured to the die and the heat sink, the heat within the die being transferred to the heat sink via the die attachment structure.

13. The high power LED lamp device as set forth in claim 11, wherein the heat sink is substantially surrounded by the housing.

14. The high power LED lamp device as set forth in claim 11, wherein the heat sink contacts the housing.

15. The high power LED lamp device as set forth in claim 11, further including:

an adhesive between the heat sink and the housing, the heat being conducted from the heat sink to the housing via the adhesive.

16. The high power LED lamp device as set forth in claim 11, wherein:

the heat sink includes a portion having a substantially cylindrical shape; and

the housing includes a portion having a substantially cylindrical shape, the substantially cylindrically shaped portion of the heat sink being surrounded by the substantially cylindrically shaped portion of the housing.

18. The method for manufacturing a high power LED lamp device as set forth in claim 17, wherein the mounting step includes:

mounting a die support between the die and the thermally conductive material, the heat within the die being conducted to the thermally conductive material via the die support.

19. The method for manufacturing a high power LED lamp device as set forth in claim 17, wherein the step of securing the housing includes:

securing an adhesive between the housing and the thermally conductive material, the heat being transferred from the thermally conductive material to the housing via the adhesive.

20. The method for manufacturing a high power LED lamp device as set forth in claim 17, wherein the step of securing the housing includes:

contacting the housing to the thermally conductive material, the heat being transferred from the thermally conductive material to the housing via the contact.

17. A method for manufacturing a high power LED lamp device, the method comprising:

securing a high power LED to a die, which supplies electrical power to the LED;

mounting a thermally conductive material to the die, heat within the die being conducted to and distributed across the thermally conductive material; and

securing a housing between the thermally conductive material and an external environment, the housing conducting the heat received from the thermally conductive material to the external environment.