Electrical interconnect structure

• US 20020142626A1
• Filed: 03/18/2002
• Published: 10/03/2002
• Est. Priority Date: 03/16/2001
• Status: Abandoned Application

• Current Assignee: Cenix, Inc. (Broadcom, Inc.)
• Original Assignee: Cenix, Inc. (Broadcom, Inc.)
• Inventors: Smeltz, Palmer D. Jr.
• Application Number:
  US10/100,266
• Publication Number:
  US 20020142626A1
• Time in Patent Office: Days
• US Class Current: 439/65
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/4204 the coupling comprising intermediate optical elements, e.g. lenses, holograms encapsulated active devices H01S5/02208, H01L33/52
• CPC Class Codes: H01P 1/047 Strip line joints

Abstract

In accordance with an exemplary embodiment of the present invention, an electrical apparatus includes a pedestal having at least one first electrical contact at a first level, and at least one second electrical contact at a second level, which is at a lower height than the first level. According to one exemplary embodiment, at least one third electrical contact electrically connects the first contact to the second contact, and is oriented substantially perpendicularly to the first and second contacts.

Acccording to another exemplary embodiment of the present invention, an optoelectronic package includes an optoelectronic device disposed over a substrate. The package also includes interfacing electrically circuitry disposed outside of the package; and an electrical interconnect having a pedestal which has at least one first electrical contact at a first level, and at least one second electrical contact at a second level, which is at a lower height than the first level. The package also includes at least one third electrical contact which electrically connects the first contact to the second contact, and is oriented substantially perpendicularly to the first and second contacts, wherein the interfacing electrical circuitry is disposed at the second level.

Claims

1. An electrical interconnect, comprising:

a pedestal having at least one first electrical contact at a first level, and at least one second electrical contact at a second level, which is at a lower height than said first level;

and at least one third electrical contact which electrically connects said at least one first contact to said at least one second contact, and is oriented substantially perpendicularly to said first and second contacts.

2. An electrical interconnect as recited in claim 1, wherein the interconnect is substantially rectangular in cross-section.

3. An electrical interconnect as recited in claim 1, wherein the interconnect is substantially square in cross-section.

4. An electrical interconnect as recited in claim 1, wherein said first, said second, and said third electrical contacts are transmission lines.

5. An electrical interconnect as recited in claim 1, wherein said transmission lines are chosen from the group consisting essentially of:

microstripline;

stripline;

coplanar stripline;

grounded coplanar stripline; and

coaxial transmission lines.

6. An electrical initerconnect as recited in claim 1, wherein said pedestal is a discrete element.

7. An electrical interconnect as recited in claim 1, wherein said pedestal is an integral part of a substrate over which a device is disposed.

8. An electrical interconnect as recited in claim 1, wherein said electrical interconnect connects an optoelectronic device to interfacing electrical circuitry.

9. An electrical interconnect as recited in claim 8, wherein the electrical interconnect provides substantially uninterrupted transmission of the correct impedance from said optical device to the interfacing electrical circuitry.

10. An electrical interconnect as recited in claim 1, wherein the electrical interconnect electrically connects one electronic device to another electronic device.

11. An electrical interconnect as recited in claim 8, wherein said optoelectronic device is disposed in a package, and said interfacing electrical circuitry is outside of said package.

13. An optoelectronic package as recited in claim 12, wherein said first, said second, and said third electrical contacts are transmission lines.

14. An optoelectronic package as recited in claim 13, wherein said transmission lines are chosen from the group consisting essentially of:

microstripline;

stripline;

coplanar stripline;

grounded coplanar stripline; and

coaxial transmission lines.

15. An optoelectronic package as recited in claim 12, wherein said electrical interconnect provides substantially uninterrupted transmission of the correct impedance from said optical device to the interfacing electrical circuitry.

12. An optoelectronic package, comprising:

An optoelectronic device disposed over a substrate;

Interfacing electrically circuitry disposed outside of said package;

An electrical interconnect having a pedestal which has at least one first electrical contact at a first level, and at least one second electrical contact at a second level, which is at a lower height than the first level; and

at least one third electrical contact which electrically connects the first contact to the second contact, and is oriented substantially perpendicularly to the first and second contacts, wherein said interfacing electrical circuitry is disposed at said second level.