×

MULTI-LINK SEGMENTATION AND REASSEMBLY FOR BONDING MULTIPLE PVC'S IN AN INVERSE MULTIPLEXING ARRANGEMENT

  • US 20020146010A1
  • Filed: 10/10/2001
  • Published: 10/10/2002
  • Est. Priority Date: 02/28/2001
  • Status: Active Grant
First Claim
Patent Images

1. A method, comprising:

  • generating a plurality of multilink segmentation and reassembly sublayer cells at a first location;

    distributing the plurality of multilink segmentation and reassembly sublayer cells across a plurality of virtual circuits;

    transmitting the plurality of multilink segmentation and reassembly sublayer cells to a second location via the plurality of virtual circuits; and

    receiving the plurality of multilink segmentation and reassembly sublayer cells at the second location.

View all claims
  • 3 Assignments
Timeline View
Assignment View
    ×
    ×