Systems and methods of monitoring thin film deposition

• US 20020152803A1
• Filed: 04/23/2001
• Published: 10/24/2002
• Est. Priority Date: 04/23/2001
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Agilent Technologies, Inc.
• Inventors: Larson, John D. III, Ko, Herbert L., Karlquist, Richard K., Carey, Kent W., Hueschen, Mark A.
• Granted Patent: US 6,668,618 B2
• Time in Patent Office: Days
• US Class Current: 73/64.53
• CPC Class Codes: C23C 14/546 using crystal oscillators
• CPC Class Codes: G01N 29/036 by measuring frequency or resonance of acoustic waves
• CPC Class Codes: G01N 29/30 Arrangements for calibrating or comparing, e.g. with standard objects
• CPC Class Codes: G01N 29/4436 with a reference signal amplitude comparison G01N29/48

Abstract

Systems and methods of monitoring thin film deposition are described. In one aspect, a thin film deposition sensor includes an acoustical resonator (e.g., a thin film bulk acoustical resonator) that has an exposed surface and is responsive to thin film material deposits on the exposed surface. A substrate clip may be configured to attach the thin film deposition sensor to a substrate. A transceiver circuit may be configured to enable the thin film deposition sensor to be interrogated wirelessly. A method of monitoring a thin film deposition on a substrate also is described.

Claims

1. A system for monitoring a thin film deposition, comprising a thin film deposition sensor comprising an acoustical resonator having an exposed surface and being responsive to thin film material deposits on the exposed surface.

2. The system of claim 1, wherein the acoustical resonator is a thin film bulk acoustical resonator (FBAR).

3. The system of claim 1, wherein the thin film deposition sensor further comprises a second acoustical resonator thermally coupled to the first acoustical resonator and shielded from deposition of thin film material.

4. The system of claim 3, wherein the first and second acoustical resonators are coupled electrically in series.

5. The system of claim 3, wherein the first and second acoustical resonators are coupled together by an electrical connection shielded from thin film material deposits.

6. The system of claim 3, further comprising a plurality of pairs of exposed and shielded acoustical resonators disposed on an elongated substrate.

7. The system of claim 1, further comprising an antenna configured to enable the thin film deposition sensor to be interrogated wirelessly.

8. A system for monitoring a thin film deposition on a substrate, comprising:

a thin film deposition sensor having an exposed surface exposed and being responsive to thin film material deposits on the exposed surface; and

a substrate clip configured to attach the thin film deposition sensor to the substrate.

9. The system of claim 8, wherein the substrate clip comprises an antenna.

10. The system of claim 8, wherein the substrate clip comprises a transceiver circuit configured to enable the thin film deposition sensor to be interrogated wirelessly.

11. The system of claim 10, wherein the transceiver circuit comprises an opto-electronic transducer.

13. The system of claim 12, further comprising a first antenna coupled to the thin film deposition sensor and a second antenna coupled to the transceiver circuit.

14. The system of claim 12, wherein the transceiver circuit is an RFID tag circuit.

15. The system of claim 12, wherein the transceiver circuit comprises an opto-electronic transducer.

17. The method of claim 17, further comprising wirelessly interrogating the thin film deposition sensor to determine the resonant frequency of the acoustical resonator.

18. The method of claim 17, wherein the thin film deposition sensor further comprises a second acoustical resonator shielded from the thin film deposition, and wirelessly interrogating the thin film deposition sensor comprises determining the resonant frequencies of the first and second acoustical resonators.

19. The method of claim 17, wherein wirelessly interrogating comprises transmitting an optical signal through an optical port of the deposition chamber.

20. The method of claim 16, wherein the thin film deposition sensor is disposed within the deposition chamber by attaching the thin film deposition sensor to the substrate.

12. A system for monitoring a thin film deposition, comprising:

a thin film deposition sensor having an exposed surface exposed and being responsive to thin film material deposits on the exposed surface; and

a transceiver circuit configured to enable the thin film deposition sensor to be interrogated wirelessly.

16. A method of monitoring a thin film deposition on a substrate, comprising:

disposing within a deposition chamber a thin film deposition sensor comprising an acoustical resonator; and

exposing a surface of the acoustical resonator to a thin film deposition.