Transmission optical module

• US 20020159722A1
• Filed: 04/16/2002
• Published: 10/31/2002
• Est. Priority Date: 04/26/2001
• Status: Active Grant

• Current Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Original Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Inventors: Tsumura, Eiji, Inujima, Takayoshi
• Granted Patent: US 6,652,160 B2
• Time in Patent Office: Days
• US Class Current: 385/92
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/4204 the coupling comprising intermediate optical elements, e.g. lenses, holograms encapsulated active devices H01S5/02208, H01L33/52
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/19107 off-chip wires

Abstract

A light-emitting device assembly in the transmission optical module in accordance with the present invention accommodates a light-emitting device in a case, whereas a connection pin electrically connected to the anode of the light-emitting device extends outward from the case. The module also has a circuit board on which an electronic device for controlling the light-emitting device is mounted, whereas the circuit board is mounted in a board mounting part of a lead frame. The circuit board is provided with a first pad to which a predetermined potential is applied, and a second pad for supplying a source voltage, whereas wires bonding the connection pin to the first and second pads respectively.

Claims

1. A transmission optical module comprising:

a light-emitting device assembly having a light-emitting device, a case for accommodating said light-emitting device, and a connection pin extending outward from said case and electrically connected to an anode of said light-emitting device;

a circuit board, on which an electronic device for controlling said light-emitting device is mounted, and having a first pad to which a predetermined potential is applied and a second pad for supplying a source voltage;

a lead frame having a board mounting part for mounting said circuit board; and

wires bonding said connection pin to said first pad and second pads respectively.

2. A transmission optical module according to claim 1, wherein said source voltage is supplied to said light-emitting device from said second pad alone.

3. A transmission optical module according to claim 1, where in said light-emitting device assembly, said circuit board, and said lead frame are encapsulated with a resin.