Method of polishing and cleaning substrates
First Claim
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1. A method of processing a substrate, comprising:
- transferring a first substrate from a storage station in a factory interface module to a polisher;
breaking in a polishing pad at the polisher with the first substrate;
returning the first substrate to the storage station;
transferring a second substrate from a cassette through the factory interface module to the polisher;
polishing the second substrate;
cleaning the second substrate; and
returning the second substrate to the cassette.
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Abstract
The substrate processing system has a factory interface module, a chemical mechanical polisher, a cleaner, a particle monitor and a substrate transfer system disposed as an integrated system. The factory interface module may includes a chamber a storage station located in a chamber of the module to hold a plurality of substrates in a substantially horizontal position. The storage station may hold pad break-in wafers for pad preconditioning and/or monitor wafers for defects monitoring. The particle monitor may have a port coupled to the factory interface module.
60 Citations
10 Claims
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1. A method of processing a substrate, comprising:
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transferring a first substrate from a storage station in a factory interface module to a polisher;
breaking in a polishing pad at the polisher with the first substrate;
returning the first substrate to the storage station;
transferring a second substrate from a cassette through the factory interface module to the polisher;
polishing the second substrate;
cleaning the second substrate; and
returning the second substrate to the cassette.
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2. A method of processing a substrate, comprising:
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transferring a substrate from a cassette through a factory interface module to a polisher;
polishing the substrate at a chemical mechanical polisher;
cleaning the substrate at a cleaner;
transferring the substrate from the cleaner through the factory interface module to a defect monitor;
measuring a defect parameter with the defect monitor; and
returning the substrate to the cassette.
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3. A method of processing substrates, comprising:
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transferring a first substrate from a cassette through a factory interface module to a polisher;
polishing the first substrate at a chemical mechanical polisher;
cleaning the first substrate at a cleaner;
transferring a second substrate from a storage station in the factory interface module to the polisher;
polishing the second substrate at the polisher;
cleaning the second substrate at the cleaner;
transferring the second substrate from the cleaner through the factory interface module to a defect monitor;
measuring a defect parameter of the second substrate with the defect monitor;
modifying a polishing parameter based on the defect parameter. - View Dependent Claims (4, 5, 6, 7, 8, 9)
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10. A method of processing substrates, comprising:
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transferring a device substrate from a cassette through a factory interface module to a polisher;
polishing the device substrate at a chemical mechanical polisher;
cleaning the device substrate at a cleaner;
transferring the device substrate from the cleaner through the factory interface module to a defect monitor;
measuring a first defect parameter of the device with the defect monitor;
transferring a monitor substrate from a storage station in the factory interface module to the polisher;
polishing the monitor substrate at the polisher;
cleaning the monitor substrate at the cleaner;
transferring the monitor substrate from the cleaner through the factory interface module to the defect monitor;
measuring a second defect parameter of the monitor substrate with the defect monitor; and
comparing the first defect parameter to the second defect parameter.
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Specification