Insulators for high density circuits
First Claim
1. An integrated circuit structure comprising:
- a substrate;
a plurality of stacked foamed polymer layers on the substrate, each of the stacked foamed polymer layers has a surface that is hydrophobic, and each of the foamed polymer layers has a cell size less than about one micron; and
a plurality of conductive structures embedded in each of the plurality of foamed polymer layers.
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Accused Products
Abstract
A conductive system and a method of forming an insulator for use in the conductive system is disclosed. The conductive system comprises a foamed polymer layer on a substrate. The foamed polymer layer has a surface that is hydrophobic, and a plurality of conductive structures are embedded in the foamed polymer layer. An insulator is formed by forming a polymer layer having a thickness on a substrate. The polymer layer is foamed to form a foamed polymer layer having a surface and a foamed polymer layer thickness, which is greater than the polymer layer thickness. The surface of the foamed polymer layer is treated to make the surface hydrophobic.
13 Citations
47 Claims
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1. An integrated circuit structure comprising:
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a substrate;
a plurality of stacked foamed polymer layers on the substrate, each of the stacked foamed polymer layers has a surface that is hydrophobic, and each of the foamed polymer layers has a cell size less than about one micron; and
a plurality of conductive structures embedded in each of the plurality of foamed polymer layers. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An integrated circuit structure comprising:
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a substrate;
a foamed material layer on the substrate, the foamed material layer having a surface that is hydrophobic; and
a plurality of conductive structures embedded in the foamed material layer. - View Dependent Claims (8, 10, 11, 12, 13, 14, 15, 17, 18, 20, 21, 22, 24, 25, 27, 28, 29, 30)
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16. An integrated circuit structure comprising:
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a substrate;
a plurality of stacked foamed aerogel layers on the substrate, each of the stacked foamed polymer layers having a surface that is hydrophobic; and
a plurality of conductive structures embedded in each of the plurality of foamed polymer layers.
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19. An integrated circuit structure comprising:
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a substrate;
a plurality of stacked foamed polyimide layers on the substrate, each of the stacked foamed polymer layers having a surface that is hydrophobic; and
a plurality of conductive structures embedded in each of the plurality of foamed polymer layers.
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23. An integrated circuit structure comprising:
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a substrate;
a plurality of electronic devices on the substrate; and
an air-bridge structure coupling two of the electronic devices, the air-bridge structure having a surface that is hydrophobic.
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26. An integrated circuit structure comprising:
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a substrate;
a foamed material layer on the substrate, the foamed material layer having a surface that is hydrophobic; and
a plurality of conductive structures embedded in the foamed material layer;
the foamed material layer formed by exposing an unfoamed material layer to a supercritical fluid to form the foamed material layer.
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31. An integrated circuit structure comprising:
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a substrate;
a foamed material layer on the substrate, the foamed material layer having a surface that is hydrophobic; and
a plurality of conductive structures embedded in the foamed material layer;
the surface of the foamed material layer formed hydrophobic by exposing the surface of the foamed material layer to a plurality of methane radicals. - View Dependent Claims (32, 33, 35, 36, 37, 38, 40, 41, 42)
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34. An integrated circuit structure comprising:
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a substrate;
a plurality of stacked foamed polymer layers on the substrate, each of the stacked foamed polymer layers having a surface that is hydrophobic; and
a plurality of conductive structures embedded in each of the plurality of foamed polymer layers;
the foamed polymer layers having a hydrophobic surface being formed by exposing an unfoamed polymer layer to a supercritical fluid to form the foamed polymer layer, and exposing the surface of each foamed polymer layer to a plurality of methane radicals.
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39. An integrated circuit structure comprising:
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a substrate;
a plurality of stacked foamed aerogel layers on the substrate, each of the stacked foamed aerogel layers having a surface that is hydrophobic;
a plurality of conductive structures embedded in each of the plurality of foamed polymer layers; and
the foamed aerogel layers having a hydrophobic surface being formed by exposing an unfoamed aerogel layer to a supercritical fluid to form the foamed aerogel layer, and exposing the surface of each foamed aerogel layer to a plurality of methane radicals.
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43. An integrated circuit structure comprising:
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a substrate;
a plurality of electronic devices on the substrate; and
an air-bridge structure coupling two of the electronic devices, the air-bridge structure having a surface that is hydrophobic;
the surface of the air-bridge structure being made hydrophobic by exposing the surface of the air-bridge structure to a plurality of methane radicals. - View Dependent Claims (44, 45, 46, 47)
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Specification