Curing light

• US 20020177095A1
• Filed: 02/04/2002
• Published: 11/28/2002
• Est. Priority Date: 09/24/1999
• Status: Active Grant

• Current Assignee: CAO Group, Inc.
• Original Assignee: CAO Group, Inc.
• Inventors: Cao, Densen
• Granted Patent: US 6,755,648 B2
• Time in Patent Office: Days
• US Class Current: 433/29
• CPC Class Codes: A61C 19/004 Hand-held apparatus, e.g. guns
• CPC Class Codes: A61N 2005/0652 Arrays of diodes
• CPC Class Codes: B23K 26/0096 Portable laser equipment, e.g. hand-held laser apparatus surgical laser instruments A61B18/20, Dental Lasers A61C1/0046, Hand-held laser dental apparatus for curing resins A61C19/004
• CPC Class Codes: B23K 26/0608 in the same heat affected zone [HAZ] B23K26/0613, B23K26/0619 take precedence
• CPC Class Codes: B23K 26/064 by means of optical elements, e.g. lenses, mirrors or prisms
• CPC Class Codes: B23K 26/0643 comprising mirrors
• CPC Class Codes: B23K 26/0648 comprising lenses
• CPC Class Codes: B23K 26/0665 by beam condensation on the workpiece, e.g. for focusing
• CPC Class Codes: B23K 26/703 Cooling arrangements by using a fluid stream B23K26/14

Abstract

A curing light system useful for curing light activated composite materials is disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.

Claims

1. A curing light comprising:

a wand adapted to be grasped by a human hand for use in positioning and manipulating the curing light,

a light module attached to said wand,

said light module including an elongate heat sink with a proximal end and a distal end, said proximal end being proximate said wand, said elongate heat sink having a longitudinal axis,

a mounting platform located at said elongate heat sink distal end, said mounting platform being adapted to have a LED chip module, and

an LED chip module mounted on said mounting platform, said LED chip module including

a primary heat sink, said primary heat sink having a smaller mass than said elongate heat sink,

a well on said primary heat sink for mounting an LED chip,

an LED chip mounted in said well,

a cover that provides protective covering for said LED chip and which permits light emitted by said LED chip to pass through it to provide usable light exiting from said light module.

2. A curing light as recited in claim 1 wherein said mounting platform is oriented so that when a light emitting semiconductor device is mounted on it, light emitted by the light emitting semiconductor device will be emitted generally orthogonal to said elongate heat sink longitudinal axis.

3. A curing light as recited in claim 1 wherein said mounting platform is oriented so that light emitted by said LED will be emitted at an angle of from about 30 degrees to about 150 degrees to said elongate heat sink longitudinal axis.

4. A curing light comprising:

an elongate heat sink with a proximal end and a distal end, said elongate heat sink having a longitudinal axis defined between said proximal end and said distal end,

an LED chip module mounted at said elongate heat sink distal end. said LED chip module including

a primary heat sink, said primary heat sink having a smaller mass than said elongate heat sink,

a well on said primary heat sink for mounting an LED chip,

an LED chip mounted in said well,

a cover that provides protective covering for said LED chip and which permits light emitted by said LED chip to pass through it to provide usable light exiting from said light module.

5. A curing light as recited in claim 4 wherein said LED chip is mounted in said well by use of a heat conductive adhesive.

6. A curing light as recited in claim 4 wherein said LED chip is mounted in said well by use of a light reflective adhesive.

7. A curing light as recited in claim 4 wherein said well has a reflective wall.

8. A curing light as recited in claim 7 wherein said reflective wall includes a material selected from the group consisting of Al, Au, Ag, Zn, Cu, Pt, chrome, metal, plating and plastic.

9. A curing light comprising:

a secondary heat sink,

a semiconductor chip module affixed to said secondary heat sink, said semiconductor chip module including

a primary heat sink,

a semiconductor chip capable of emitting a light useful for curing composite materials mounted to said primary heat sink, and

a cover that provides protective covering for said semiconductor chip and which permits light emitted by said semiconductor chip to pass through it to provide light useful for curing composite materials.

10. A curing light as recited in claim 0 wherein said semiconductor chip is selected from the group consisting of light emitting diode chips, laser chips, light emitting diode chip array, diode laser chips, diode laser chip array, surface emitting laser chips, edge emitting laser chips, and VCSEL chips.

11. A curing light comprising:

a wand adapted to be grasped by a human hand,

a battery power source located within said wand,

electronic control circuitry located within said wand,

a light module, said light module including an elongate heat sink with a proximal end and a distal end, said proximal end being proximate said wand, said elongate heat sink having a longitudinal axis, and elongate heat sink being adapted to draw heat away from a semiconductor located at said elongate heat sink distal end,

a mounting location located at said elongate heat sink distal end,

a semiconductor chip module located at said mounting location, said semiconductor chip module including

a primary heat sink mounted to said elongate heat sink at said mounting location,

a semiconductor chip capable of emitting light useful for curing light activated composite materials mounted to said primary heat sink, and

a cover that provides protective covering for said semiconductor chip and which permits light emitted by said semiconductor chip to pass through it to provide light useful for curing composite materials.

12. A curing light as recited in claim 11 wherein said semiconductor chip is selected from the group consisting of light emitting diode chips, laser chips, light emitting diode chip array, diode laser chips, diode laser chip array, surface emitting laser chips, edge emitting laser chips, and VCSEL chips.

13. A curing light as recited in claim 12 further comprising a switch on said want for initiating emission of light from said semiconductor chip.

14. A curing light as recited in claim 11 wherein said mounting platform is oriented so that when a light emitting semiconductor device is mounted on it, light emitted by the light emitting semiconductor device will be emitted generally orthogonal to said elongate heat sink longitudinal axis.

15. A curing light as recited in claim 11 wherein said mounting platform is oriented so that light emitted by said chip is emitted in a direction that is at an angle of from about 30 degrees to about 150 degrees to said elongate heat sink longitudinal axis.

16. A curing light as recited in claim 12 further comprising a well in said primary heat sink, said chip being located in said well.

17. A curing light as recited in claim 16 wherein said well includes a reflective wall.

18. A curing light as recited in claim 17 wherein said reflective wall includes a material selected from the group consisting of Al, Au, Ag, Zn, Cu, Pt, chrome, metal, plating and plastic.

19. A curing light as recited in claim 11 wherein said cover is selected from the group consisting of windows and focus lenses.

20. A curing light comprising:

a wand designed to be grasped by a human hand,

controls for initiating and terminating light transmission by the curing light,

circuitry in electrical connection with said controls,

a power source for powering the curing light,

a light module that is part of the curing light, said light module including;

a primary heat sink,

a light emitting semiconductor device, mounted to said primary heat sink, and

a cover covering said light emitting semiconductor device but permitting light emitted by said light emitting semiconductor device to pass through said cover,

21. A curing light as recited in claim 20 wherein said primary heat sink has a well on it, and wherein said light emitting semiconductor device is mounted in said well.

22. A curing light as recited in claim 20 wherein said well has a light-reflective surface that includes a material selected from the group consisting of Al, Au, Ag, Zn, Cu, Pt, chrome, metal, plating and plastic.

23. A curing light as recited in claim 20 further comprising an elongate heat sink located in said wand, said primary heat sink being affixed to said elongate heat sink, and said elongate heat sink serving to draw heat away from said primary heat sink.