Solid state optical shutter

• US 20020185590A1
• Filed: 07/31/2002
• Published: 12/12/2002
• Est. Priority Date: 01/03/2000
• Status: Active Grant

• Current Assignee: Microsoft International Holdings BV (Microsoft Corporation)
• Original Assignee: 3DV Systems Ltd. (Microsoft Corporation)
• Inventors: Iddan, Gavriel J., Yahav, Giora
• Granted Patent: US 6,794,628 B2
• Time in Patent Office: Days
• US Class Current: 250/214.1
• CPC Class Codes: H01L 31/125 Composite devices with photosensitive elements and electroluminescent elements within one single body

Abstract

A method of producing an optoelectronic circuit comprising: forming a first optoelectronic element of the circuit on a first surface of a semiconductor substrate; forming a second optoelectronic element of the circuit on a second surface of the semiconductor substrate; and wherein the first and second optoelectronic elements communicate via current transmitted through the substrate.

Claims

1. A method of producing an optoelectronic circuit comprising:

forming a first optoelectronic element of the circuit on a first surface of a semiconductor substrate;

forming a second optoelectronic element of the circuit on a second surface of the semiconductor substrate; and

wherein the first and second optoelectronic elements communicate via current transmitted through the substrate.

2. A method according to claim 1 wherein the semiconductor substrate is a planar substrate.

3. A method according to claim 1 or claim 2 wherein forming the first and second optoelectronic elements comprises doping the first and second surfaces respectively.

4. A method according to claim 1 wherein the semiconductor material of the substrate comprises a material selected from the group consisting of silicon, GaAs and InP.

5. An optoelectronic circuit comprising:

a semiconductor substrate;

a first optoelectronic element of a circuit located on a first surface of the substrate;

a second optoelectronic element of a circuit located on a second surface of the substrate; and

a communication link comprising a current path through the substrate via which information is communicated between the first and second optoelectronic elements.