Cavity down ball grid array packaging structure

• US 20020195721A1
• Filed: 03/05/2002
• Published: 12/26/2002
• Est. Priority Date: 06/21/2001
• Status: Abandoned Application

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: Lin, Yu-Hsien, Lee, Chun-Chi, Feng, Yao-Hsin, Liao, Kuan-Neng, Hsieh, Jaw-Shiun, Kuo, Hou-Chang
• Application Number:
  US10/091,945
• Publication Number:
  US 20020195721A1
• Time in Patent Office: Days
• US Class Current: 257/780
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/4911 the connectors being bonded to at least one common bonding area, e.g. daisy chain
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1532 the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

In a cavity down BGA packaging structure, a circuit substrate is bonded onto a heat spreader. A cavity formed is formed in the circuit substrate into which a chip is bonded onto the heat spreader. The circuit substrate has at least an insulating layer, a patterned wiring layer, and a via electrically connected to the heat spreader. A first ground pad, ball pad, and first contact pad are defined on the patterned wiring layer, wherein the first ground pad is spaced apart from and electrically connected to the via. The chip comprises at least a second contact pad and a second ground pad respectively connected to the first contact pad and the heat spreader. An encapsulant material encapsulates the cavity, the chip, and the first and second contact pads. A plurality of solder balls are attached to the first ground pad and ball pad.

Claims

1. A cavity down ball grid array packaging structure, comprising:

a heat spreader including a chip-mounting region at a central portion and a substrate-mounting region located around the chip-mounting region;

a substrate bonded to the heat spreader in the substrate-mounting region, wherein the substrate comprises at least an insulating layer, a patterned wiring layer, and a via electrically connected to the heat spreader, and the patterned wiring layer comprises at least a ball pad, a first contact pad, and a first ground pad spaced apart from and electrically connected to the via;

a chip having an active surface and a corresponding back surface, the chip being bonded in the chip-mounting region of the heat spreader, wherein the active surface of the chip includes at least a second contact pad electrically connected to the first contact pad and a second ground pad electrically connected to the heat spreader;

an encapsulant material encapsulating the chip, the first and second contact pads; and

a plurality of solder balls attached to the ball pad and first ground pad.

2. The packaging structure of claim 1, wherein the heat spreader further includes a ground substrate bonded onto the substrate-mounting region, the ground substrate having an opening exposing the heat spreader at the chip-mounting region to form a cavity.

3. The packaging structure of claim 2, wherein the second ground pad of the chip is connected to the ground substrate on the heat spreader via a conductive wire.

4. The packaging structure of claim 1, wherein the heat spreader further includes a cavity therein at the chip-mounting region and the chip is mounted on a bottom surface of the cavity in the heat spreader.

5. The packaging structure of claim 4, wherein the second ground pad of the chip is connected to the heat spreader via a conductive wire.

6. The packaging structure of claim 1, wherein the first and second contact pads are connected to each other via a conductive wire.

7. The packaging structure of claim 1, wherein the via contacts with the first ground pad.

8. The packaging structure of claim 1, wherein the first ground pad is electrically connected to the via by means of a ground conductive wiring.

9. The packaging structure of claim 8, wherein the via is formed by disposing a conductive ball in a via opening and reflowing the conductive ball to form a conductive material filling the via opening and overlapping onto the ground conductive wiring.

10. A cavity down ball grid array packaging carrier, suitable for use in a chip packaging structure, the cavity down ball grid array carrier comprising:

a heat spreader including a chip-mounting region at a central portion and a substrate-mounting region located around the chip-mounting region; and

a substrate bonded to the heat spreader over the substrate-mounting region, wherein the substrate comprises at least an insulating layer, a patterned wiring layer, and a via connected to the heat spreader, and the patterned wiring layer comprises at least a ball pad, a contact pad, and a ground pad spaced apart from and electrically connected to the via.

11. The packaging carrier of claim 10, wherein the heat spreader further includes a ground substrate bonded onto the substrate-mounting region, the ground substrate having an opening exposing the heat spreader at the chip-mounting region to form a cavity.

12. The packaging carrier of claim 10, wherein the heat spreader further includes a cavity therein at the chip-mounting region and the chip is mounted on a bottom surface of the cavity in the heat spreader.

13. The packaging carrier of claim 10, wherein the via contacts the ground pad.

14. The packaging carrier of claim 10, wherein the patterned wiring layer further includes a ground conductive wiring connecting the via to the ground pad.