Curing light
First Claim
Patent Images
1. A curing light comprising:
- a wand adapted to be grasped by a human hand for use in positioning and manipulating the curing light, controls on said wand for initiating and terminating light emission from the curing light, a secondary heat sink which serves a heat dissipation function, a primary heat sink which is attached to said secondary heat sink and which has less total mass than said primary heat sink, a well on said primary heat sink for mounting an LED array chip therein, an LED array on a single chip mounted in said well, said LED array on a single chip including a substrate, a quantity of semiconductor material located on said substrate, at least one metal electrode strip arranged into column formation on said LED array chip, at least one electrode pad for providing electrical connection of said LED array chip, a cover that provides protective covering for said chip and which permits light emitted by said chip to substantially pass through it.
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Accused Products
Abstract
A curing light system useful for curing light activated composite materials is disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.
41 Citations
20 Claims
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1. A curing light comprising:
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a wand adapted to be grasped by a human hand for use in positioning and manipulating the curing light, controls on said wand for initiating and terminating light emission from the curing light, a secondary heat sink which serves a heat dissipation function, a primary heat sink which is attached to said secondary heat sink and which has less total mass than said primary heat sink, a well on said primary heat sink for mounting an LED array chip therein, an LED array on a single chip mounted in said well, said LED array on a single chip including a substrate, a quantity of semiconductor material located on said substrate, at least one metal electrode strip arranged into column formation on said LED array chip, at least one electrode pad for providing electrical connection of said LED array chip, a cover that provides protective covering for said chip and which permits light emitted by said chip to substantially pass through it. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 16, 17, 18, 19)
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15. A curing light comprising:
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a housing for housing components of a curing light, a manual control for initiating and terminating light transmission from the curing light, electronic circuitry for controlling operation of the curing light, a primary heat sink which serves to dissipate heat, an LED array on a single chip mounted on said primary heat sink, said LED array on a single chip including a substrate, a quantity of semiconductor material located on said substrate, a plurality of epitaxial layers in said semiconductor material, at least one of said epitaxial layers being selected from the group consisting of contact layers, cladding layers, buffer layers and active layers at least one metal electrode strip arranged into column formation on said LED array chip, at least one electrode pad for providing electrical connection of said LED array chip, a cover that provides protective covering for said chip and which permits light emitted by said chip to substantially pass through it.
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20. A curing light comprising:
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a housing for housing components of a curing light, a manual control for initiating and terminating light transmission from the curing light, electronic circuitry for controlling operation of the curing light, a primary heat sink which serves to dissipate heat, an LED array on a single chip mounted on said primary heat sink, said LED array on a single chip including a substrate, said substrate being selected from the group consisting of Si, GaAs, GaN, InP, sapphire, SiC, GaSb, and InAs, a quantity of semiconductor material located on said substrate, a plurality of epitaxial layers in said semiconductor material, at least one of said epitaxial layers being selected from the group consisting of contact layers, cladding layers, buffer layers and active layers, at least one of said epitaxial layers including a material from the group consisting of GaN, AlGaN, and InGaN, at least one metal electrode strip arranged into column formation on said LED array chip, at least one electrode pad for providing electrical connection of said LED array chip, and a cover that provides protective covering for said chip and which permits light emitted by said chip to substantially pass through it;
wherein said LED array chip has a dimension a×
b where each of a and b is less than 300 micrometers.
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Specification
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Current AssigneeCAO Group, Inc.
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Original AssigneeCAO Group, Inc.
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InventorsCao, Densen
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Granted Patent
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Time in Patent OfficeDays
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Field of Search
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US Class Current315/56
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CPC Class CodesA61C 19/004 Hand-held apparatus, e.g. gunsA61N 2005/0652 Arrays of diodesB23K 26/0096 Portable laser equipment, e...B23K 26/0608 in the same heat affected z...B23K 26/064 by means of optical element...B23K 26/0643 comprising mirrorsB23K 26/703 Cooling arrangements by usi...Y10S 362/80 Light emitting diodeY10S 362/804 Surgical or dental spotlight
