Semiconductor light emitting device package
First Claim
Patent Images
1. A semiconductor package comprising:
- a first conductor having a face end and a first length;
a second conductor at least partially surrounding the first conductor and having a second length;
a first insulator disposed between the first conductor and the second conductor; and
a flip chip semiconductor device electrically connected to the face end of the first conductor and to the second conductor.
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Accused Products
Abstract
A semiconductor package includes two or more conductors. An inner conductor may provide an attachment point for one or more semiconductor devices at an end of the inner conductor and an electrical connection at an opposite end. An outer conductor may be pressed onto the inner conductor and may be separated by an electrical insulator. A semiconductor device, such as a light emitting diode, may be attached to the inner conductor and to the outer conductor. The package may be, for example, cylindrical or a rectangular solid. The package may incorporate additional semiconductor mounting surfaces and more than two conductors.
13 Citations
22 Claims
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1. A semiconductor package comprising:
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a first conductor having a face end and a first length;
a second conductor at least partially surrounding the first conductor and having a second length;
a first insulator disposed between the first conductor and the second conductor; and
a flip chip semiconductor device electrically connected to the face end of the first conductor and to the second conductor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 14, 15, 16, 17, 18, 19, 20)
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13. A semiconductor package, comprising:
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a first conductor having a face end and a first length;
a second conductor at least partially surrounding the first conductor and having a second length;
a first insulator disposed between the first conductor and the second conductor;
a first semiconductor device attached to the face end of the first conductor and to the second conductor;
a third conductor at least partially surrounding the second conductor and having a third length;
a second insulator separating the third and the second conductors; and
a second semiconductor device attached to the first conductor and to the third conductor.
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21. A coaxial package for mounting electrical components, comprising:
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an inner conductor, comprising;
a first surface for mounting the electrical components; and
an electrical connection section for coupling the package to an electrical supply;
at least one outer conductor generally coaxial with the inner conductor; and
an electrical insulator disposed between the inner and each of the at least one outer conductors. - View Dependent Claims (22)
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Specification