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Automated semiconductor processing system

  • US 20030017034A1
  • Filed: 04/30/2001
  • Published: 01/23/2003
  • Est. Priority Date: 04/28/1994
  • Status: Active Grant
First Claim
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1. A processing system for semiconductor articles, comprising:

  • an interface section and a processing section with an enclosure with the interface section including;

    a first carriage at a first vertical level and having a first location for receiving and holding a first carrier containing a first array of articles;

    a first lift head supported on a first elevator and vertically movable through a first opening in the first carriage at the first location, with the first lift head having a plurality of grooves for engaging the first array of articles, and for lifting the array of articles up and out of the first carrier;

    a second carriage at a second vertical level above the first level, with the second carriage linearly movable, in a first direction relative to the first elevator, and with the second carriage having at least a first article support formed by a first pair of spaced apart support arms, and with the support arms having a plurality of arm grooves;

    with the array of articles movable from the first carrier to the first article support via vertical movement of the first elevator lifting the array of articles up and out of the first carrier, horizontal movement of the second carriage, in the first direction relative to the array of wafers supported on the first elevator, followed by vertical movement downwardly, to place the array of articles onto the first article support;

    a processing section comprising at least one processing station having a rotor rotatably supported within a process chamber, the rotor having combs for holding the array of articles; and

    a robotic conveyor movable, in a second direction, perpendicular to the first direction, between the at least one processing station and the article support, with the robotic conveyor having an articulated arm and an article transfer implement attached to an end of the articulated arm, and with the transfer implement having a pair of transfer implement arms spaced apart by a fixed distance, and with the transfer implement arms having grooves therein for receiving and holding the array of wafers with the transfer implement movable into and out of the rotor, to place articles in or remove articles out of the rotor.

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