Integrated circuit cooling apparatus
First Claim
1. An apparatus for cooling an electronic device, said apparatus comprising:
- a mounting structure having a receiving aperture in alignment with said electronic device;
a thermal head adapted to be inserted into and guided by said receiving aperture such that a cooled surface of said thermal head will be in thermal contact with said electronic device;
said thermal head defining a flow channel for passage of a refrigerant fluid so as to cause cooling at said cooled surface;
a clamping arrangement attached to said mounting structure to maintain said thermal head in operative position; and
a refrigeration system in fluid communication with said flow channel of said thermal head to supply refrigerant fluid thereto.
7 Assignments
0 Petitions
Accused Products
Abstract
An apparatus for cooling a computer'"'"'s microprocessor includes a thermal housing having a receiving aperture in alignment with the microprocessor. A thermal head is inserted into and guided by the receiving aperture such that a cooled surface of the thermal head will begin thermal contact with the microprocessor. The thermal head defines a flow channel for passage of a refrigerant fluid so as to cause cooling at the cooled surface. A clamping arrangement is attached to the mounting structure to maintain the thermal head in operative position. The apparatus further includes a refrigeration system in fluid communication with the flow channel of the thermal head to supply refrigerant fluid thereto.
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Citations
77 Claims
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1. An apparatus for cooling an electronic device, said apparatus comprising:
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a mounting structure having a receiving aperture in alignment with said electronic device;
a thermal head adapted to be inserted into and guided by said receiving aperture such that a cooled surface of said thermal head will be in thermal contact with said electronic device;
said thermal head defining a flow channel for passage of a refrigerant fluid so as to cause cooling at said cooled surface;
a clamping arrangement attached to said mounting structure to maintain said thermal head in operative position; and
a refrigeration system in fluid communication with said flow channel of said thermal head to supply refrigerant fluid thereto. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A thermal housing for attachment to a planar circuit board having thereon at least one electronic device to be cooled, said thermal housing comprising:
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a removable first housing member located on a first side of said circuit board, said first housing member defining an interior in which said electronic device is located;
a removable second housing member located on a second side of said circuit board opposite to said first housing member such that said circuit board will be sandwiched therebetween;
at least said first housing member being formed of a thermally conductive material; and
a first heater element associated with said first housing member to heat an outer surface thereof so as to prevent condensation from forming thereon. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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31. An apparatus comprising:
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a planar circuit board having thereon at least one electronic device to be cooled;
a thermal housing having a removable first housing member and a removable second housing member;
said first housing member located on a first side of said circuit board and defining an interior in which said electronic device is located;
said first housing member further defining a receiving aperture in alignment with said electronic device;
a thermal head adapted to be inserted into and guided by said receiving aperture such that a cooled surface of said thermal head will be in thermal contact with said electronic device; and
said second housing member being located on a second side of said circuit board opposite to said first housing member such that said circuit board will be sandwiched therebetween. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45)
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46. An evaporator for a cooling apparatus used for cooling an electronic device, said evaporator comprising:
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a thermal head having a cooled surface for thermal contact with said electronic device;
said thermal head defining a flow channel for passage of a refrigerant fluid so as to cause cooling at said cooled surface, said flow channel having a configuration generally characterized by a plurality of arcuate and concentric passage segments;
said flow channel of said thermal head having an inlet and outlet for respective ingress and egress of said refrigerant fluid;
an inlet tube in fluid communication with said inlet of said thermal head; and
an outlet tube in fluid communication with said outlet of said thermal head. - View Dependent Claims (47, 48, 49, 50, 51, 52, 53, 54, 55)
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56. An apparatus for cooling an electronic device, said apparatus comprising:
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a mounting structure having a receiving aperture in alignment with said electronic device;
a thermal head axially movable in said receiving aperture such that a cooled surface of said thermal head will be guided in thermal contact with said electronic device;
said thermal head defining a flow passage for passage of a refrigerant fluid so as to cause cooling at said cooled surface; and
a clamping arrangement attached to said mounting structure to maintain said thermal head in operative position, said clamping arrangement including a spring element to urge said thermal head into engagement with said electronic device. - View Dependent Claims (57, 58, 59, 60, 61, 62, 63, 64, 65, 66)
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67. An evaporator for a cooling apparatus used for cooling an electronic device, said evaporator comprising:
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a thermal head having a cooled surface for thermal contact with said electronic device;
said thermal head defining a flow channel for passage of a refrigerant fluid so as to cause cooling at said cooled surface;
said flow channel of said thermal head having an inlet and outlet for respective ingress and egress of said refrigerant fluid;
an inlet tube and an outlet tube in fluid communication with said inlet and said outlet of said thermal head, respectively; and
said inlet tube being located inside of said outlet tube for a predetermined length so as to provide a counterflow heat exchanger. - View Dependent Claims (68, 69, 70, 71)
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72. An apparatus for cooling an electronic device, said apparatus comprising:
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a thermal housing having an interior in which said electronic device is located, said thermal housing serving to isolate said interior thereof from an ambient environment;
a desiccant material located in said interior of said thermal housing to absorb moisture located therein;
a thermal head having a cooled surface in thermal contact with said electronic device; and
said thermal head defining a flow channel for passage of a refrigerant fluid so as to cause cooling at said cooled surface. - View Dependent Claims (73, 74, 75, 76, 77)
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Specification