Optical sub-assembly for optoelectronic modules

  • US 20030026556A1
  • Filed: 06/06/2002
  • Published: 02/06/2003
  • Est. Priority Date: 08/03/2001
  • Status: Active Grant
First Claim
Patent Images

1. An optoelectronic package comprising:

  • a base substrate having a first face and a second face that are angled relative to one another and electrical traces that extend from the first face to the second face;

    a semiconductor chip assembly mounted on the first face of the base substrate, the semiconductor chip assembly having a plurality of first contacts that are electrically coupled to associated traces on the base substrate; and

    a photonic device mounted on the second face of the base substrate, the photonic device having at least one active facet thereon and having a plurality of second contacts that are electrically coupled to associated traces on the base substrate.

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