Light-emitting device, method of manufacturing a light-emitting device, and electronic equipment
First Claim
1. A light-emitting device comprising:
- a first plastic substrate;
a second plastic substrate;
a light emitting element formed between the first plastic substrate and the second plastic substrate;
a plurality of insulating films covering the first plastic substrate and the second plastic substrate;
a plastic film covering the plurality of insulating films, wherein an internal stress of at least one of the plurality of insulating films is smaller than that of the other insulating films.
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Accused Products
Abstract
The present invention uses plastic film in vacuum sealing an OLED. Inorganic insulating films which can prevent oxygen or water from being penetrated therein and an organic insulating film which has a smaller internal stress than that of the inorganic insulating films are laminated on an inside of the plastic film. By sandwiching the organic insulating film between the inorganic insulating films, a stress can be relaxed. Further, by laminating a plurality of inorganic insulating films, even if one of the inorganic insulating films has a crack, the other inorganic insulating films can effectively prevent oxygen or water from being penetrated into an organic light emitting layer. Further, the stress of the entire sealing film can be relaxed and cracking due to the stress takes place less often.
218 Citations
45 Claims
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1. A light-emitting device comprising:
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a first plastic substrate;
a second plastic substrate;
a light emitting element formed between the first plastic substrate and the second plastic substrate;
a plurality of insulating films covering the first plastic substrate and the second plastic substrate;
a plastic film covering the plurality of insulating films, wherein an internal stress of at least one of the plurality of insulating films is smaller than that of the other insulating films. - View Dependent Claims (3, 4, 7, 8, 9, 10, 12, 13)
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2. A light-emitting device comprising:
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a first plastic substrate;
a second plastic substrate;
a light emitting element formed between the first plastic substrate and the second plastic substrate;
a first insulating film covering the first plastic substrate and the second plastic substrate;
a second insulating film covering the first insulating film;
a third insulating film covering the second insulating film; and
a plastic film covering the third insulating film, wherein an internal stress of the second insulating film is smaller than that of the first insulating film and third insulating film.
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5. A light-emitting device comprising:
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a first plastic substrate;
a light emitting element formed over the first plastic substrate;
a plurality of insulating films covering the first plastic substrate and the light emitting element; and
a plastic film covering the plurality of insulating films, wherein an internal stress of at least one of the plurality of insulating films is smaller than that of the other insulating films. - View Dependent Claims (11)
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6. A light-emitting device comprising:
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a first plastic substrate;
a light emitting element formed over the first plastic substrate;
a first insulating film covering the first plastic substrate and the light emitting element;
a second insulating film covering the first insulating film;
a third insulating film covering the second insulating film; and
a plastic film covering the third insulating film, wherein an internal stress of the second insulating film is smaller than that of the first insulating film and third insulating film.
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14. A method of manufacturing a light-emitting device, comprising:
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putting a first plastic substrate and a second plastic substrate that sandwich a light emitting element into a bag-like plastic film, an inside of the plastic film covered with layers of a plurality of insulating films;
exhausting the bag-like plastic film; and
closing a mouth of the bag-like plastic film, wherein an internal stress of at least one of the plurality of insulating films is smaller than that of the other insulating films. - View Dependent Claims (16, 17, 45)
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15. A method of manufacturing a light-emitting device, comprising:
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putting a plastic substrate having a light emitting element formed over the plastic substrate into a bag-like plastic film, an inside of the plastic film covered with layers of the plurality of insulating films;
exhausting the bag-like plastic film; and
closing the mouth of the bag-like plastic film, wherein an internal stress of at least one of the plurality of insulating films is smaller than that of the other insulating films.
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18. A method of manufacturing a light-emitting device, comprising:
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forming a first adhesive layer on a first substrate;
forming a first insulating film on the first adhesive layer;
forming a light emitting element over the first insulating film;
forming a second insulating film so as to cover the light emitting element;
bonding a second substrate to the second insulating film using a second adhesive layer;
removing the first adhesive layer to remove the first substrate and expose the first insulating film;
bonding a third substrate to the first insulating film using a third adhesive layer;
providing a bag-like plastic film, in which a plurality of insulating films are laminated on an inside of the bag-like plastic film such that the laminated plurality of insulating films cover the second substrate and the third substrate;
exhausting the bag-like plastic film; and
closing a mouth of the bag-like plastic film, wherein the second substrate and the third substrate comprise plastic, and wherein an internal stress of at least one of the plurality of insulating films is smaller than that of the other insulating films. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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19. A method of manufacturing a light-emitting device, comprising:
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forming a first adhesive layer on a first substrate;
forming a first insulating film on the first adhesive layer;
forming a light emitting element, a thin film transistor, and a wiring line over the first insulating film;
forming a second insulating film so as to cover the light emitting element, the thin film transistor, and the wiring line;
bonding a second substrate to the second insulating film using a second adhesive layer;
removing the first adhesive layer to remove the first substrate and expose the first insulating film;
bonding a third substrate to the first insulating film using a third adhesive layer;
removing the second substrate, the second insulating film, and a part of the second adhesive layer to expose a part of the wiring line;
electrically connecting the exposed part of the wiring line with a terminal of an FPC using an anisotropic conductive resin;
providing a bag-like plastic film, in which a plurality of insulating films are laminated on an inside of the bag-like plastic film such that the laminated plurality of insulating films cover the second substrate and the third substrate;
exhausting the bag-like plastic film; and
closing a mouth of the bag-like plastic film, wherein the second substrate and the third substrate comprise plastic, and wherein an internal stress of at least one of the plurality of insulating films is smaller than that of the other insulating films.
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20. A method of manufacturing a light-emitting device, comprising:
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forming a first adhesive layer on a first substrate;
forming a first insulating film on the first adhesive layer;
forming a light emitting element, a thin film transistor, and a wiring line over the first insulating film;
forming a second insulating film so as to cover the light emitting element, the thin film transistor, and the wiring line;
bonding a second substrate to the second insulating film using a second adhesive layer;
removing the first adhesive layer to remove the first substrate and expose the first insulating film;
bonding a third substrate to the first insulating film using a third adhesive layer;
removing the third substrate, the first insulating film, and a part of the third adhesive layer to expose a part of the wiring line;
electrically connecting the exposed part of the wiring line with a terminal of an FPC using an anisotropic conductive resin;
providing a bag-like plastic film, in which a plurality of insulating films are laminated on an inside of the bag-like plastic such that the laminated plurality of insulating films cover the second substrate and the third substrate;
exhausting the bag-like plastic film; and
closing a mouth of the bag-like plastic film, wherein the second substrate and the third substrate comprise plastic, and wherein an internal stress of at least one of the plurality of insulating films is smaller than that of the other insulating films.
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31. A method of manufacturing a light-emitting device, comprising:
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forming a first adhesive layer on a first substrate;
forming a first insulating film on the first adhesive layer;
forming a light emitting element over the first insulating film;
forming a second insulating film so as to cover the light emitting element;
bonding a second substrate to the second insulating film using a second adhesive layer;
removing the first adhesive layer to remove the first substrate and expose the first insulating film;
bonding a third substrate to the first insulating film using a third adhesive layer;
removing the second adhesive layer to remove the second substrate and expose the second insulating film;
providing a bag-like plastic film, in which a plurality of insulating films are laminated on an inside of the bag-like plastic film such that the laminated plurality of insulating films cover the second substrate and the third substrate;
exhausting the bag-like plastic film; and
closing a mouth of the bag-like plastic film, wherein the third substrate comprises plastic, and wherein an internal stress of at least one of the plurality of insulating films is smaller than that of the other insulating films. - View Dependent Claims (34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44)
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32. A method of manufacturing a light-emitting device, comprising:
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forming a first adhesive layer on a first substrate;
forming a first insulating film on the first adhesive layer;
forming a light emitting element, a thin film transistor, and a wiring line over the first insulating film;
forming a second insulating film so as to cover the light emitting element, the thin film transistor, and the wiring line;
bonding a second substrate to the second insulating film using a second adhesive layer;
removing the first adhesive layer to remove the first substrate and expose the first insulating film;
bonding a third substrate to the first insulating film using a third adhesive layer;
removing the second adhesive layer to remove the second substrate and expose the second insulating film;
removing a part of the second insulating film to expose a part of the wiring line;
electrically connecting the exposed part of the wiring line with a terminal of an FPC using an anisotropic conductive resin;
providing a bag-like flexible plastic film, in which a plurality of insulating films are laminated on an inside such that the laminated plurality of insulating films cover the second substrate and the third substrate;
exhausting the bag-like plastic film; and
closing a mouth of the bag-like plastic film, wherein the third substrate comprises plastic, and wherein an internal stress of at least one of the plurality of insulating films is smaller than that of the other insulating films.
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33. A method of manufacturing a light-emitting device, comprising:
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forming a first adhesive layer on a first substrate;
forming a first insulating film on the first adhesive layer;
forming a light emitting element, a thin film transistor, and a wiring line over the first insulating film;
forming a second insulating film so as to cover the light emitting element, the thin film transistor, and the wiring line;
bonding a second substrate to the second insulating film using a second adhesive layer;
removing the first adhesive layer to remove the first substrate and expose the first insulating film;
bonding a third substrate to the first insulating film using a third adhesive layer;
removing the second adhesive layer to remove the second substrate and expose the second insulating film;
removing the third substrate, the first insulating film, and a part of the third adhesive layer to expose a part of the wiring line;
electrically connecting the exposed part of the wiring line with a terminal of an FPC using an anisotropic conductive resin;
providing a bag-like flexible plastic film, in which a plurality of insulating films are laminated on an inside of the bag-like plastic film such that the laminated plurality of insulating films cover the second substrate and the third substrate;
exhausting the bag-like plastic film; and
closing a mouth of the bag-like plastic film, wherein the third substrate comprises, and wherein an internal stress of at least one of the plurality of insulating films is smaller than that of the other insulating films.
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Specification