Flexible printed circuit board with reinforcing plate

• US 20030042042A1
• Filed: 04/10/2002
• Published: 03/06/2003
• Est. Priority Date: 04/12/2001
• Status: Active Grant

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: Jo, Kyouyuu, Miyake, Yasufumi
• Granted Patent: US 6,602,584 B2
• Time in Patent Office: Days
• US Class Current: 174/254
• CPC Class Codes: B32B 7/00 Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/0064 onto a polymeric substrate
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/24843 with heat sealable or heat releasable adhesive layer
• CPC Class Codes: Y10T 428/24917 including metal layer

Abstract

A flexible printed circuit board with a reinforcing plate, which comprises: a flexible printed circuit board including i) a conductive circuit pattern layer, and ii) an insulating layer made of a plastic film; a reinforcing plate; and an adhesive layer so that the reinforcing plate is attached to the flexible printed circuit board via the adhesive layer, wherein the adhesive layer is formed from an adhesive composition containing a composite metal hydroxide represented by formula (1):

M_1-xQ_x(OH)₂  (1)

wherein M is at least one metal atom selected from the group consisting of Mg, Ca, Sn and Ti; Q is at least one metal atom selected from the group consisting of Mn, Fe, Co, Ni, Cu and Zn; and x is a positive number from 0.01 to 0.5.

Claims

1. A flexible printed circuit board with a reinforcing plate, which comprises:

a flexible printed circuit board including i) a conductive circuit pattern layer, and ii) an insulating layer made of a plastic film;

a reinforcing plate; and

an adhesive layer so that the reinforcing plate is attached to the flexible printed circuit board via the adhesive layer,

wherein the adhesive layer is formed from an adhesive composition containing a composite metal hydroxide represented by formula (1);

M_1-xQ_x(OH)₂ 

 

(1)

wherein M is at least one metal atom selected from the group consisting of Mg, Ca, Sn and Ti;

Q is at least one metal atom selected from the group consisting of Mn, Fe, Co, Ni, Cu and Zn; and

x is a positive number from 0.01 to 0.5.

2. The flexible printed circuit board with a reinforcing plate according to claim 1, wherein the conductive pattern is formed on one side of the flexible printed circuit board, and the reinforcing plate is attached on the other side of the flexible printed circuit board via the adhesive layer using the adhesive composition containing the composite metal hydroxide represented by the formula (1).

3. The flexible printed circuit board with a reinforcing plate according to claim 1, wherein the conductive pattern is formed on both sides of the plastic film, and the reinforcing plate is attached on one side of the flexible printed circuit board via the adhesive layer using the adhesive composition containing the composite metal hydroxide represented by the formula (1).

4. The flexible printed circuit board with a reinforcing plate according to claim 1, wherein the adhesive composition contains 20 to 50% by weight of the composite metal hydroxide.

5. The flexible printed circuit board with a reinforcing plate according to claim 1, wherein the composite metal hydroxide is Mg_1-xNi_x(OH)₂, in which 0.01<

X<

0.5.

6. The flexible printed circuit board with a reinforcing plate according to claim 1, wherein the composite metal hydroxide is Mg_1-xZn_x(OH)₂, in which 0.01<

X<

0.5.

7. The flexible printed circuit board with a reinforcing plate according to claim 1, wherein the adhesive layer has a complex modulus of elasticity at 25°

C. of 100 MPa or more and a complex modulus of elasticity at 70°

C. of 10 MPa or more.

8. The flexible printed circuit board with a reinforcing plate according to claim 1, wherein the adhesive layer has a complex modulus of elasticity at 25°

C. of 100 to 3,000 MPa and a complex modulus of elasticity at 70°

C. of 10 to 300 MPa.