Embedded PCB identification

• US 20030047350A1
• Filed: 09/11/2001
• Published: 03/13/2003
• Est. Priority Date: 09/11/2001
• Status: Active Grant

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Intel Corporation
• Inventors: Forbes, Brian S.
• Granted Patent: US 7,317,310 B2
• Time in Patent Office: Days
• US Class Current: 174/255
• CPC Class Codes: H05K 1/0266 Marks, test patterns or identification means
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2201/10159 Memory
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A method of tracking a printed circuit board is described. An embedded identification device is utilized. The embedded identification device is placed in a layer of the printed circuit board. An external transceiver is used to communicate with the embedded device and record platform information.

Claims

1. A method of tracking a printed circuit board, comprising:

placing a programmed integrated circuit in a layer of the printed circuit board; and

using a transceiver to communicate with the integrated circuit in the printed circuit board.

2. The method of claim 1, further comprising recording the printed circuit board information using software.

3. The method of claim 1, wherein the printed circuit board is a four-layer printed circuit board.

4. The method of claim 1, wherein the integrated circuit is programmed with a part number.

5. The method of claim 1, wherein the integrated circuit is placed in a ground layer of the printed circuit board.

6. The method of claim 5, wherein the integrated circuit is placed in the northwest corner of the printed circuit board.

7. The method of claim 1, wherein the integrated circuit is a passive radio frequency device.

8. The method of claim 1, wherein the integrated circuit is a flash memory.

9. The method of claim 8, wherein the flash memory is a flash electrically erasable read only memory.

10. The method of claim 1, wherein the printed circuit board is tracked using a computer laptop transceiver.

11. The method of claim 1, wherein the printed circuit board is tracked using a cellular phone transceiver.

12. A method of manufacturing a printed circuit board to accommodate an embedded tracking device, comprising:

designing a printed circuit board, wherein the device land pattern is allocated in the internal layers of the printed circuit board;

defining an area surrounding the device land pattern; and

testing the design.

13. The method of claim 12, further comprising:

processing a plurality of inner layers of the printed circuit board;

compressing the plurality of inner layers of the printed circuit board;

drilling via holes in the printed circuit board; and

adding components to the printed circuit board.

14. The method of claim 13, further comprising:

reflowing, wherein the printed circuit board is baked;

adding connectors;

wave soldering, wherein the assembled printed boards are brought in contact with solder; and

testing the printed circuit board for functionality.

15. The method of claim 12, wherein the outlined area surrounding the device land pattern is approximately 300 mils.

16. The method of claim 15, wherein the outlined area is not exposed to reflowing and wave soldering.

17. A printed circuit board comprising:

a first signal layer;

a second signal layer;

a power layer;

a first prepeg layer, wherein the first prepeg layer is located between the first signal layer and the power layer;

a core layer;

a ground layer, wherein the ground layer comprises a void to store a printed circuit board tracking device; and

a second prepeg layer, wherein the second prepeg layer is located between the ground layer and the second signal layer.

18. The printed circuit board of claim 17, wherein the core layer is located between the power layer and the ground layer.

19. An apparatus comprising:

means for storing a printed circuit board identification number;

means for tracking platform information; and

means for communicating with an external transceiver.

20. The apparatus of claim 19 further comprising a means for recording the printed circuit board information.

21. The apparatus of claim 19 further comprising a means for testing the printed circuit board.

22. A method of testing a printed circuit board, comprising:

placing an integrated circuit in a ground layer of the printed circuit board; and

using a transceiver to communicate with the integrated circuit in the printed circuit board.

23. The method of claim 22, wherein testing information is stored in the integrated circuit.

24. The apparatus of claim 22, wherein a radio frequency transceiver is used to communicate with the integrated circuit.