Sensor substrate and method of fabricating same
First Claim
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1. A sensing apparatus comprising:
- a substrate having a first side for a sensing element and a second side for electronics; and
a via making electrical contact from the first side of the substrate to the second side of the substrate, wherein the via is hermetically sealed from the first side of the substrate to the second side of the substrate.
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Abstract
A substrate with hermetically sealed vias extending from one side of the substrate to another and a method for fabricating same. The vias may be filled with a conductive material such as, for example, a fritless ink. The conductive path formed by the conductive material aids in sealing one side of the substrate from another. One side of the substrate may include a sensing element and another side of the substrate may include sensing electronics.
133 Citations
30 Claims
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1. A sensing apparatus comprising:
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a substrate having a first side for a sensing element and a second side for electronics; and
a via making electrical contact from the first side of the substrate to the second side of the substrate, wherein the via is hermetically sealed from the first side of the substrate to the second side of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of forming an hermetically sealed substrate comprising:
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obtaining a substrate material;
forming a via from a first side of the substrate to a second side of the substrate; and
filling the via with a conductive material such that an hermetic seal forms between the first side of the substrate and the second side of the substrate. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A sensing apparatus comprising:
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a substrate having a first area for a sensing element and a second area for electronics; and
a via making electrical contact from the first area of the substrate to the second area of the substrate, wherein the via is hermetically sealed from the first area of the substrate to the second area of the substrate. - View Dependent Claims (30)
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Specification