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Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus

  • US 20030092371A1
  • Filed: 12/27/2002
  • Published: 05/15/2003
  • Est. Priority Date: 05/15/1997
  • Status: Active Grant
First Claim
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1. A polishing pad for polishing a substrate in a chemical mechanical polishing apparatus, comprising:

  • a first polishing region having a first plurality of substantially circular concentric grooves with a first width and a first pitch;

    a second polishing region surrounding the first polishing region and having a second plurality of substantially circular concentric grooves with a second width and a second pitch; and

    wherein at least one of the second width and second pitch differs from the first width and first pitch.

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