Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
First Claim
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1. A polishing pad for polishing a substrate in a chemical mechanical polishing apparatus, comprising:
- a first polishing region having a first plurality of substantially circular concentric grooves with a first width and a first pitch;
a second polishing region surrounding the first polishing region and having a second plurality of substantially circular concentric grooves with a second width and a second pitch; and
wherein at least one of the second width and second pitch differs from the first width and first pitch.
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Abstract
A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.
14 Citations
42 Claims
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1. A polishing pad for polishing a substrate in a chemical mechanical polishing apparatus, comprising:
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a first polishing region having a first plurality of substantially circular concentric grooves with a first width and a first pitch;
a second polishing region surrounding the first polishing region and having a second plurality of substantially circular concentric grooves with a second width and a second pitch; and
wherein at least one of the second width and second pitch differs from the first width and first pitch. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A polishing pad for polishing a substrate in a chemical mechanical polishing system, comprising:
a polishing surface having a first polishing region and a second polishing region surrounding the first polishing region, a spiral groove formed in the polishing surface, the spiral groove having a first pitch in the first polishing region and a second, different pitch in the second polishing region. - View Dependent Claims (16, 17, 18, 19)
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20. A polishing pad for polishing a substrate in a chemical mechanical polishing apparatus, comprising:
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a first polishing region having a first plurality of substantially circular concentric grooves; and
a second polishing region surrounding the first polishing region and having a plurality of substantially serpentine grooves. - View Dependent Claims (21, 22, 23, 24, 25, 26)
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27. A polishing pad for polishing a substrate in a chemical mechanical polishing apparatus, comprising:
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a first polishing region having a first plurality of substantially circular concentric grooves; and
a second polishing region surrounding the first polishing region and having a second plurality of substantially circular concentric grooves, a center of the second plurality of concentric grooves being offset from a center of the first plurality of concentric grooves. - View Dependent Claims (28, 29, 30, 31, 32)
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33. A polishing pad for polishing a substrate in a chemical mechanical polishing apparatus, comprising:
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a first polishing region having a first plurality of substantially circular concentric grooves; and
a second polishing region surrounding the first polishing region and having a plurality of groove arc segments, the groove arc segments disposed along concentric circular paths such that each groove arc segment does not radially overlap a groove arc segment on an adjacent path. - View Dependent Claims (34, 35, 36, 37)
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38. A polishing pad for polishing a substrate in a chemical mechanical polishing apparatus, comprising:
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a first polishing region having a first plurality of substantially circular concentric grooves; and
a second polishing region surrounding the first polishing region and having a spiral groove. - View Dependent Claims (39, 40, 41, 42)
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Specification