Device for creating a neural interface and method for making same
First Claim
1. An implant device for creating a neural interface with the central nervous system comprising at least one electrode sandwiched within a bi-layer polyimide insulating substrate and at least one via formed within said bi-layer polyimide substrate.
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Abstract
An implant device for creating a neural interface with the central nervous system having a polyimide-based electrode array is presented along with a method for making the device. The device may be configured as a three dimensional structure and is capable of sensing multi-unit neural activity from the cerebral cortex. Mechanical, electrical and biological characteristics of the device support its use as a reliable, long term implant.
176 Citations
40 Claims
- 1. An implant device for creating a neural interface with the central nervous system comprising at least one electrode sandwiched within a bi-layer polyimide insulating substrate and at least one via formed within said bi-layer polyimide substrate.
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9. An implant device for creating a neural interface with the central nervous system comprising,
a first flexible thermoplastic layer; -
a second flexible thermoplastic layer;
a metal layer sandwiched between said first and second layers;
at least one electrode formed from said metal layer; and
at least one via formed within said first and second layers. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. An electrode array for creating a multi-channel neural interface with the central nervous system comprising:
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at least two electrodes sandwiched within a bi-layer polyimide insulating substrate; and
at least one via formed within said bi-layer polyimide insulating substrate. - View Dependent Claims (27, 28, 29, 30, 31)
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32. A method for making a device for creating a neural interface with the central nervous system comprising the steps of:
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providing a silicon substrate;
growing an oxide layer over said silicon substrate;
depositing and processing a first polyimide layer over said oxide layer;
depositing and patterning a conductive layer over said first polyimide layer;
depositing and processing a second polyimide layer over said conductive layer; and
dissolving said oxide layer. - View Dependent Claims (33, 34, 35, 36, 37, 38, 39, 40)
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Specification