×

Semiconductor device and manufacturing method thereof

  • US 20030116867A1
  • Filed: 12/02/2002
  • Published: 06/26/2003
  • Est. Priority Date: 12/20/2001
  • Status: Active Grant
First Claim
Patent Images

1. A semiconductor device, comprising:

  • a semiconductor element having an electrode formed on a surface thereof, and a metal wiring formed on the surface of the semiconductor element and electrically connected to the electrode, wherein the metal wiring has an external electrode portion functioning as an external electrode, and a thickness of the external electrode portion is greater than that of a non-electrode portion of the metal wiring, i.e., a portion of the metal wiring other than the external electrode portion.

View all claims
  • 8 Assignments
Timeline View
Assignment View
    ×
    ×