Integrated circuit comprising an auxiliary component, for example a passive component or a microelectromechanical system, placed above an electronic chip, and the corresponding fabrication process
First Claim
1. A process for fabricating an integrated circuit comprising the production of an electronic chip and the production of at least one auxiliary component placed above the chip and of a protective cover which covers the auxiliary component, wherein the chip is produced from a first semiconductor substrate, in that the auxiliary component is produced from a second semiconductor substrate, separate from the first and in that the second substrate supporting the auxiliary component is made to adhere mutually to the first semiconductor substrate in an adhesion region lying outside a cavity containing the auxiliary component and extending into one or other of the two substrates or into both substrates, the second substrate then also forming the protective cover.
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Accused Products
Abstract
The fabrication of an integrated circuit includes a first phase of producing an electronic chip and a second phase of producing at least one auxiliary component placed above the chip and of producing a protective cover which covers the auxiliary component. The first phase of producing the chip is effected from a first semiconductor substrate and comprises the formation of a cavity lying in a chosen region of the chip and emerging at the upper surface of the chip. The second production phase includes the production of the auxiliary component from a second semiconductor substrate, separate from the first, and then the placement in the cavity of the auxiliary component supported by the second substrate and the mutual adhesion of the second substrate to the upper surface of the chip lying outside the cavity. The second substrate then also forms the protective cover.
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Citations
26 Claims
- 1. A process for fabricating an integrated circuit comprising the production of an electronic chip and the production of at least one auxiliary component placed above the chip and of a protective cover which covers the auxiliary component, wherein the chip is produced from a first semiconductor substrate, in that the auxiliary component is produced from a second semiconductor substrate, separate from the first and in that the second substrate supporting the auxiliary component is made to adhere mutually to the first semiconductor substrate in an adhesion region lying outside a cavity containing the auxiliary component and extending into one or other of the two substrates or into both substrates, the second substrate then also forming the protective cover.
- 16. An integrated circuit comprising an electronic chip, at least one auxiliary component placed above the chip and a protective cover which covers the auxiliary component, wherein the auxiliary component projects from the lower face of a semiconductor substrate and extends into a cavity made in the chip or in the semiconductor substrate or in both, in that the substrate also forms the protective cover, in that the lower face of the substrate is fixed to that portion of the upper surface of the chip lying outside the cavity and in that the upper face of the substrate supporting the auxiliary component is approximately plane.
Specification