Dielectric structure
First Claim
Patent Images
1. A capacitor structure comprising a first conductive layer, a second conductive layer and a multilayer dielectric structure disposed between the first and second conductive layers, wherein the multilayer dielectric structure comprises a first dielectric layer and a second dielectric layer, wherein the first dielectric layer has a textured surface.
1 Assignment
0 Petitions
Accused Products
Abstract
Dielectric structures particularly suitable for use in capacitors and having a textured surface are provided, together with methods of forming these structures. Such dielectric structures show increased adhesion of subsequently applied conductive layers.
54 Citations
20 Claims
- 1. A capacitor structure comprising a first conductive layer, a second conductive layer and a multilayer dielectric structure disposed between the first and second conductive layers, wherein the multilayer dielectric structure comprises a first dielectric layer and a second dielectric layer, wherein the first dielectric layer has a textured surface.
- 6. A method of improving the adhesion of a deposited conductive layer to a dielectric structure comprising the steps of depositing on a dielectric layer a top dielectric layer comprising porogen, removing the porogen to provide a textured surface on the top dielectric layer, and plating an electrode on the surface of the top dielectric layer.
- 13. A printed circuit board comprising an embedded capacitance material, wherein the embedded capacitance material comprises a multilayer dielectric structure comprising a first dielectric layer and a second dielectric layer, wherein the first dielectric layer has a textured surface.
- 18. A method of manufacturing a multilayer printed circuit board comprising the step of embedding a capacitance material in one or more layers of the multilayer printed circuit board, wherein the capacitance material comprises a multilayer dielectric structure comprising a first dielectric layer and a second dielectric layer, wherein the first dielectric layer has a textured surface.
Specification