Anisotropically conductive film

• US 20030155656A1
• Filed: 01/17/2003
• Published: 08/21/2003
• Est. Priority Date: 01/18/2002
• Status: Abandoned Application

• Current Assignee: Avery Dennison Corporation
• Original Assignee: Avery Dennison Corporation
• Inventors: Chu, Philip Yi Zhi, Chuang, Hsiao Ken, Chiu, Cindy Chia-Wen, Barker, H. Paul, Chen, David Hsein-Pin
• Application Number:
  US10/346,288
• Publication Number:
  US 20030155656A1
• Time in Patent Office: Days
• US Class Current: 257/774
• CPC Class Codes: H01L 2224/11334 using preformed bumps
• CPC Class Codes: H01L 2224/16237 the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H05K 2201/09945 Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
• CPC Class Codes: H05K 2201/10234 Metallic balls solder balls H05K2203/041
• CPC Class Codes: H05K 2201/10378 Interposers
• CPC Class Codes: H05K 3/323 by applying an anisotropic conductive adhesive layer over an array of pads

Abstract

An anisotropically conductive structure for providing electrical interconnection between electronic components, and the process for making such anisotropically conductive structure. The anisotropically conductive structure includes a dielectric matrix having a substantially uniform thickness; an array of vias extending into or through the matrix; a plurality of conductive elements, wherein individual via contains at least one conductive element; a first adhesive layer adhered to the first major surface of the matrix; and optionally, a second adhesive layer adhered to the second major surface of the matrix.

Claims

1. An anisotropically conductive structure comprising:

a dielectric matrix having a substantially uniform thickness and having a first major surface and a second major surface;

an array of vias extending from the first major surface to the second major surface of the matrix, wherein the opening of the via at the first major surface is larger than the opening of the via at the second major surface;

a plurality of conductive elements, wherein individual vias contain at least one conductive element; and

a first adhesive layer adhered to the first major surface of the matrix.

2. The anisotropically conductive structure of claim 1 wherein the conductive element comprises a conductive microsphere having a narrow size distribution, wherein the diameter of the microspheres is less than the thickness of the matrix, less than the size of the opening of the via at the first major surface and greater than the size of the opening of the via at the second major surface.

3. The anisotropically conductive structure of claim 2 wherein the conductive microspheres have a diameter within the range of about 2 to about 150 microns.

4. The anisotropically conductive structure of claim 1 wherein the conductive elements are selected from the group consisting of tin, lead, bismuth, zinc, indium, aluminum, copper, silver, gold, nickel, cobalt, iron, palladium, tungsten, gallium and alloys of these metals, metalized glass, metalized polymers and metalized ceramics.

5. The anisotropically conductive structure of claim 1 wherein the conductive element comprises a plurality of conductive particles dispersed in a binder.

6. The anisotropically conductive structure of claim 1 wherein the matrix comprises a polymeric film.

7. The anisotropically conductive structure of claim 6 wherein the matrix comprises a thermoplastic film.

8. The anisotropically conductive structure of claim 6 wherein the matrix comprises a polymeric film selected from the group consisting of polyolefins, both linear and branched, polyamides, polyimides, polystyrenes, polyurethanes, polysulfones, polysulfides, polyesters, polyvinyls, polyvinyl chloride, polyvinyl acetals, polycarbonates, polyketones, polyethers, phenoxy resins, acrylic polymers, silicone, fluoroelastomer, urethane, acrylic, butyl rubber and copolymers and blends thereof.

9. The anisotropically conductive structure of claim 6 wherein the matrix comprises a multilayer polymeric film.

10. The anisotropically conductive structure of claim 1 further comprising a second adhesive layer adhered to the second major surface of the matrix.

11. The anisotropically conductive structure of claim 1 further comprising a release liner on the first adhesive layer.

12. The anisotropically conductive structure of claim 1 wherein the vias within the array are symmetrically spaced throughout the array.

13. The anisotropically conductive structure of claim 1 wherein the vias within the array are asymmetrically spaced throughout the array.

14. The anisotropically conductive structure of claim 1 wherein the first adhesive comprises a multilayer adhesive.

15. The anisotropically conductive structure of claim 10 wherein the second adhesive comprises a multilayer adhesive.

16. The anisotropically conductive structure of claim 1 wherein at least one predetermined via contains no conductive element.

17. An anisotropically conductive structure comprising:

a dielectric matrix having a substantially uniform thickness and having a first major surface and a second major surface;

an array of vias extending from the first major surface into the thickness of the matrix forming an array of microindentations of uniform depth in the matrix;

a plurality of conductive elements, wherein individual vias contain at least one conductive element; and

a first adhesive layer adhered to the first major surface of the matrix.

18. The anisotropically conductive structure of claim 17 wherein the conductive element comprises a conductive microsphere having a narrow size distribution, wherein the diameter of the microspheres is less than the thickness of the matrix and less than the size of the opening of the via at the first major surface.

19. The anisotropically conductive structure of claim 18 wherein the conductive microspheres have a diameter within the range of about 2 to about 150 microns.

20. The anisotropically conductive structure of claim 17 wherein the conductive elements are selected from the group consisting of tin, lead, bismuth, zinc, indium, aluminum, copper, silver, gold, nickel, cobalt, iron, palladium, tungsten, gallium and alloys of these metals, metalized glass, metalized polymers and metalized ceramics.

21. The anisotropically conductive structure of claim 17 wherein the conductive element comprises a plurality of conductive particles dispersed in a binder.

22. The anisotropically conductive structure of claim 17 wherein the matrix comprises a polymeric film.

23. The anisotropically conductive structure of claim 22 wherein the matrix comprises a thermoplastic film.

24. The anisotropically conductive structure of claim 22 wherein the matrix comprises a polymeric film selected from the group consisting of polyolefins, both linear and branched, polyamides, polyimides, polystyrenes, polyurethanes, polysulfones, polysulfides, polyesters, polyvinyls, polyvinyl chloride, polyvinyl acetals, polycarbonates, polyketones, polyethers, phenoxy resins, acrylic polymers, silicone, fluoroelastomer, urethane, acrylic, butyl rubber and copolymers and blends thereof.

25. The anisotropically conductive structure of claim 22 wherein the matrix comprises a multilayer polymeric film.

26. The anisotropically conductive structure of claim 17 further comprising a second adhesive layer adhered to the second major surface of the matrix.

27. The anisotropically conductive structure of claim 17 further comprising a release liner on the first adhesive layer.

28. The anisotropically conductive structure of claim 17 wherein the vias within the array are symmetrically spaced throughout the array.

29. The anisotropically conductive structure of claim 17 wherein the vias within the array are asymmetrically spaced throughout the array.

30. The anisotropically conductive structure of claim 17 wherein the first adhesive comprises a multilayer adhesive.

31. The anisotropically conductive structure of claim 26 wherein the second adhesive comprises a multilayer adhesive.

32. The anisotropically conductive structure of claim 17 wherein at least one predetermined via contains no conductive element.

33. A method for making an anisotropically conductive structure comprising the steps of:

providing a multilayer structure comprising a dielectric film having a first major surface and a second major surface, and a carrier layer having an inner surface and an outer surface, wherein the inner surface is releasably adhered to the second major surface of the dielectric film;

forming an array of tapered vias extending from the first major surface of the dielectric film into the thickness of the dielectric film with an embossing device having an array of tapered projections projecting therefrom;

filling individual tapered vias with at least one conductive element; and

removing the carrier layer.

34. The method of claim 33 wherein the height of the projections is at least equal to the thickness of the dielectric film.

35. The method of claim 34 wherein the tapered vias extend from the first major surface of the dielectric film to the second major surface of the dielectric film.

36. The method of claim 33 wherein the tapered vias extend from the first major surface into the thickness of the matrix to form an array of microindentations of uniform depth in the matrix.

37. The method of claim 35 wherein the carrier layer has a plurality of channels extending from the inner surface to the outer surface, the channels being aligned with the array of vias formed in the dielectric film.

38. The method of claim 37 wherein filling the tapered vias comprises applying a vacuum to the other surface of the carrier layer.

39. The method of claim 33 wherein the conductive element comprises conductive microspheres.

40. The method of claim 33 wherein filling the tapered vias comprises jetting conductive microspheres into the vias.

41. The method of claim 39 wherein the conductive microspheres have a diameter less than the thickness of the dielectric film and less than the opening of the via at the first major surface.

42. The method of claim 33 wherein the conductive element comprises conductive particles dispersed in a binder.

43. The method of claim 33 wherein the dielectric film comprises a thermoplastic film.

44. The method of claim 33 wherein the dielectric film comprises a film selected from selected from the group consisting of polyolefins, both linear and branched, polyamides, polyimides, polystyrenes, polyurethanes, polysulfones, polysulfides, polyesters, polyvinyls, polyvinyl chloride, polyvinyl acetals, polycarbonates, polyketones, polyethers, phenoxy resins, acrylic polymers, silicone, fluoroelastomer, urethane, acrylic, butyl rubber and copolymers and blends thereof.

45. The method of claim 33 further comprising the step of applying an adhesive layer to at least one of the first major surface of the dielectric film and the second major surface of the dielectric film.

46. The method of claim 45 wherein the adhesive layer is releasably adhered to a release liner.

47. The method of claim 33 wherein the adhesive layer comprises a multilayer adhesive.

48. A method for making an anisotropically conductive structure comprising the steps of:

providing a dielectric film having a first major surface and a second major surface;

forming an array of tapered vias extending from the first major surface of the dielectric film into the thickness of the dielectric film with an embossing device having an array of tapered projections projecting therefrom; and

filling individual the tapered vias with at least one conductive element.

49. The method of claim 48 wherein the height of the projections is less than the thickness of the dielectric film.

50. The method of claim 48 wherein the tapered vias extend from the first major surface into the thickness of the matrix to form an array of microindentations of uniform depth in the matrix.

51. The method of claim 48 wherein the conductive element comprises conductive microspheres.

52. The method of claim 48 wherein filling the tapered vias comprises jetting conductive microspheres into the vias.

53. The method of claim 51 wherein the conductive microspheres have a diameter less than the thickness of the dielectric film and less than the opening of the via at the first major surface.

54. The method of claim 48 wherein the conductive element comprises conductive particles dispersed in a binder.

55. The method of claim 48 wherein the dielectric film comprises a thermoplastic film.

56. The method of claim 48 wherein the dielectric film comprises a film selected from selected from the group consisting of polyolefins, both linear and branched, polyamides, polyimides, polystyrenes, polyurethanes, polysulfones, polysulfides, polyesters, polyvinyls, polyvinyl chloride, polyvinyl acetals, polycarbonates, polyketones, polyethers, phenoxy resins, acrylic polymers, silicone, fluoroelastomer, urethane, acrylic, butyl rubber and copolymers and blends thereof.

57. The method of claim 48 further comprising the step of applying an adhesive layer to at least one of the first major surface of the dielectric film and the second major surface of the dielectric film.

58. The method of claim 57 wherein the adhesive layer is releasably adhered to a release liner.

59. The method of claim 57 wherein the adhesive layer comprises a multilayer adhesive.