Manufacturing method of rigid-flexible printed circuit board and structure thereof

  • US 20030173105A1
  • Filed: 03/07/2003
  • Published: 09/18/2003
  • Est. Priority Date: 03/07/2002
  • Status: Active Grant
First Claim
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1. A method of manufacturing a printed circuit board, comprising:

  • preparing a plurality of printed films, each of which includes a thermoplastic resin film and a conductive circuit formed on at least one side of the resin film;

    forming holes in the resin films of the printed films;

    filling an interlayer connection material into the holes, for forming an interlayer connector for electrically connecting the conductive circuits between adjacent resin films;

    stacking the printed films in a stacking direction; and

    bonding the resin films of the stacked printed films by heating and pressurizing, so that a multi-layer printed circuit board is formed, wherein the method further comprising a slit forming step for forming a silt at a predetermined position at least in a part of the resin films of the printed films, and the silt forming step is performed before the stacking.

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