Sensor for profiling system

• US 20030174579A1
• Filed: 12/20/2002
• Published: 09/18/2003
• Est. Priority Date: 12/20/2001
• Status: Active Grant

• Current Assignee: Goudreau Gage Dubuc
• Original Assignee: Global E-Bang Inc.
• Inventors: Rioux, Daniel
• Granted Patent: US 7,073,405 B2
• Time in Patent Office: Days
• US Class Current: 367/37
• CPC Class Codes: G01V 1/16 Receiving elements for seismic signals; Arrangements or adaptations of receiving elements
• CPC Class Codes: G01V 1/22 Transmitting seismic signals to recording or processing apparatus

Abstract

A sensor for detecting an acceleration on a surface. The sensor exchanging messages with a computing means through a communication interface. The sensor comprises an accelerometer for outputting a signal representative of the acceleration and an interface unit comprising a transmitting circuit. The interface unit receives the signal representative of the acceleration and modulates the same for transmission to the computing means.

Claims

1. A sensor for detecting an acceleration on a surface, said sensor exchanging messages with a computing means through a communication interface, said sensor comprising:

a. an accelerometer for outputting a signal representative of said acceleration; and

b. an interface unit comprising a transmitting circuit, said interface unit receiving said signal representative of said acceleration and modulating the same for transmission to said computing means.

2. The sensor of claim 1, wherein said accelerometer comprises a semi conductor substrate.

3. The sensor of claim 2, wherein said semi conductor substrate comprises at least one of a strain gauge, a capacitor, and a piezo-electrical device.

4. The sensor of claim 1, wherein said interface unit further comprises an amplification unit for amplifying said electrical signal.

5. The sensor of claim 4, wherein said signal representative of said acceleration comprises an analog electrical signal and wherein said interface unit further comprises an analog-to-digital converter for converting said analog electrical signal to a digital signal.

6. The sensor of claim 5, wherein said interface unit further comprises a control circuit for controlling at least one of a level of amplification of said amplification unit and a dynamic range of said analog-to-digital converter.

7. The sensor of claim 5, wherein said interface unit further comprises an a frequency filtering means for filtering said analog electrical signal.

8. The sensor of claim 4, further comprising a power source providing electrical power to said substrate and said interface unit.

9. The sensor of claim 4, wherein power to said substrate and said interface unit is provided external said sensor.

10. The sensor of claim 2, wherein said semi conductor substrate comprises at least one of a strain gauge etched directly onto, a strain gauge build up by deposit onto, and a strain gauge glued onto said semi conductor substrate.

11. The sensor of claim 2, wherein said semi conductor substrate comprises two strain gauge assemblies and two matched resistors forming a Wheatstone bridge, said two strain gauge assemblies located on two opposite branches of said Wheatstone bridge, and said two matched resistors located on the other two opposite branches of said Wheatstone bridge.

12. The sensor of claim 11, wherein each of said two strain gauge assemblies comprises two strain gauges connected in parallel.

13. The sensor of claim 12, wherein said substrate comprises a calibration resistor placed in parallel with one of said two matched resistors.

14. The sensor of claim 1, wherein said transmitting circuit comprises at least one of an antenna and an optical transceiver relaying at least one of said modulated signal and messages through said communication interface.

15. The sensor of claim 14, further comprises a processor connected to said accelerometer and said interface unit for controlling and managing the same.

16. The sensor of claim 15, further comprises a memory means connected to said processor for storing at least one of samplings of said signal representative of said acceleration and instructions for operation of said processor.

17. The sensor of claim 16, further comprising a positioning circuit connected to said processor means.

18. The sensor of claim 17, wherein said positioning circuit comprises at least one of a gyroscope and a Global Positioning System.

19. A sensing assembly comprising at least two sensors of claim 16.

20. The sensing assembly of claim 19, wherein said at least two sensors are in communication with each other.

21. The sensing assembly of claim 20, wherein said memory means stores a unique identifier for each one of said at least two sensors.

22. A sensor for detecting an acceleration on a surface, said sensor exchanging messages with a computing means through a communication interface, said sensor comprising:

a. a substrate comprising an accelerometer for outputting a signal representative of said acceleration;

b. a mass attached to said substrate, said mass moving in response to said acceleration; and

c. an interface unit comprising a transmitting circuit, said interface unit receiving said signal representative of said displacement and modulating the same for transmission to said computing means.

23. The sensor of claim 22, wherein said accelerometer comprises a semi-conductor substrate.

24. The sensor of claim 23, wherein said semi conductor substrate comprising an opening within which said mass is supported.

25. The sensor of claim 22, further comprising:

a. a housing supporting said semi conductor substrate; and

b. a damping means mounted between said housing and said mass.

26. The sensor of claim 25, wherein said damping means comprises material being resistant to fatigue.

27. The sensor of claim 26, wherein said material resistant to fatigue comprises at least one of neoprene and silicone.

28. The sensor of claim 27, further comprising a shock absorbing element between said damping means and said housing.

29. The sensor of claim 25, wherein said housing comprises a bottom plate which provides a physical interface between said sensor and said surface.

30. The sensor of claim 29, wherein said housing further comprising a casing mounted on said bottom plate.

32. The sensor of claim 29, wherein said bottom plate comprises attachment means for providing attachment of said sensor to said surface.

33. The sensor of claim 32, wherein said attachment means comprises at least one of a threaded attachment, an adhesive, a weight, a magnetic material device, and an explosive driven type anchoring means.

34. The sensor of claim 33, wherein said housing comprises an electrically conductive surface for substantially shielding said sensor from electromagnetic interference.

35. The sensor of claim 34, wherein said transmitting circuit comprises at least one of an antenna and an IR diffuser relaying at least one of said modulated signal and messages through said communication interface.

36. The sensor of claim 33, further comprises a processor connected to said accelerometer and said interface unit for controlling and managing the same.

37. The sensor of claim 36, further comprises a memory means connected to said processor for storing at least one of samplings of said electrical signal and instructions for operation of said processor.

38. The sensor of claim 37, further comprising a positioning circuit connected to said processor means.

39. The sensor of claim 38, wherein said positioning circuit comprises at least one of a gyroscope and a Global Positioning System.

40. A sensing assembly comprising at least two sensors of claim 22.

41. The sensing assembly of claim 40, wherein said at least two sensors are in communication with each other.

42. The sensing assembly of claim 41, wherein said memory means stores a unique identifier for each one of said at least two sensors.

31. The sensor of claim 31, wherein said housing further comprising a top cover hermetically mounted on said casing.

43. A sensor for detecting a displacement on a surface, said sensor being in communication with a computing means and comprising a semi conductor substrate to which are integrated a semi conductor strain gauge for outputting an electrical signal representative of said displacement;

an amplification unit for amplifying said electrical signal; and

control circuit for controlling a level of amplification.

44. The sensor of claim 43, wherein said electrical signal comprises an analog electrical signal and wherein is further integrated to said semi conductor substrate an analog-to-digital converter for converting said analog electrical signal to a digital signal and wherein said control circuit controls a dynamic range of said analog-to-digital converter.