EMI feedthrough filter terminal assembly for human implant applications utilizing oxide resistant biostable conductive pads for reliable electrical attachments

• US 20030179536A1
• Filed: 02/27/2003
• Published: 09/25/2003
• Est. Priority Date: 02/28/2002
• Status: Active Grant

• Current Assignee: Greatbatch Limited (Greatbatch Incorporated)
• Original Assignee: Greatbatch-Sierra, Inc.
• Inventors: Frysz, Christine A., Brendel, Richard L., Stevenson, Robert A., Woods, Jason, Zeng, Haitong
• Granted Patent: US 6,765,779 B2
• Time in Patent Office: Days
• US Class Current: 361/302
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors
• CPC Class Codes: Y02E 60/13 Energy storage using capacitors

Abstract

An EMI feedthrough filter terminal assembly includes a feedthrough filter capacitor having first and second sets of electrode plates, a passageway having a first termination surface conductively coupling the first set of electrode plates, and a second termination surface exteriorly coupling the second set of electrode plates. A conductive ferrule disposed adjacent to the capacitor includes a conductive pad of an oxide resistant biostable material on a surface thereof conductively coupled to the second termination surface. A conductive terminal pin extends through the passageway in conductive relation with the first set of electrode plates, and through the ferrule in non-conductive relation. An insulator is fixed to the ferrule for conductively isolating the terminal pin from the ferrule. A hermetic seal is disposed between the insulator and the ferrule. A second conductive pad may be conductively attached to the terminal pin and to the first termination surface independently of the lead wire.

Claims

1. An EMI feedthrough filter terminal assembly, comprising:

a feedthrough filter capacitor including first and second sets of electrode plates, a passageway therethrough having a first termination surface conductively coupling the first set of electrode plates, and a second termination surface exteriorly coupling the second set of electrode plates;

a conductive ferrule adjacent to the feedthrough filter capacitor;

at least one conductive terminal pin extending through the passageway in conductive relation with the first set of electrode plates, and through the ferrule in non-conductive relation;

an insulator fixed to the ferrule for conductively isolating the terminal pin from the ferrule; and

an oxide resistant conductive hermetic seal between the insulator and the ferrule, the oxide resistant conductive seal including an oxide resistant conductive pad on a surface of the ferrule conductively coupled to the second termination surface.

2. The terminal assembly of claim 1, including a conductive connector extending between the second termination surface and the oxide resistant conductive pad.

3. The terminal assembly of claim 2, wherein the conductive connector is taken from the group consisting of conductive polyimide, solder, weld or braze.

4. The terminal assembly of claim 1, wherein the oxide resistant conductive pad comprises a noble metal.

5. The terminal assembly of claim 4, wherein the noble metal is taken from the group consisting of gold, platinum, and oxide resistant alloys thereof.

6. The terminal assembly of claim 1, wherein the second termination surface comprises a plurality of second termination surfaces and wherein the oxide resistant conductive pad includes a corresponding plurality of pads conductively coupled to the plurality of second termination surfaces.

7. The terminal assembly of claim 1, including means for hermetically sealing passage of the terminal pin through the ferrule.

8. The terminal assembly of claim 1, wherein the ferrule and the insulator comprise a pre-fabricated hermetic terminal pin sub-assembly.

9. The terminal assembly of claim 1, wherein the first passageway through the feedthrough filter capacitor comprises a plurality of first passageways each having a distinct first termination surface conductively coupled to a distinct first set of electrode plates, and wherein the at least one conductive terminal pin comprises a terminal pin extending through each of the plurality of first passageways.

10. The terminal assembly of claim 1, including an insulative washer disposed between the feedthrough filter capacitor and the insulator.

11. The terminal assembly of claim 10, wherein the insulative washer comprises a thermal plastic polyimide supported tape.

12. The terminal assembly of claim 11, wherein the thermal plastic polyimide supported tape comprises Ableloc.

13. The terminal assembly of claim 10, wherein the washer includes a gap adjacent to the terminal pin.

14. The terminal assembly of claim 1, including a second oxide resistant conductive pad conductively attached to the at least one terminal pin, and means for conductively coupling the second oxide resistant conductive pad to the first termination surface independently of the terminal pin.

15. The terminal assembly of claim 14, wherein the second oxide resistant conductive pad comprises a noble metal.

16. The terminal assembly of claim 1, specifically constructed for medical implant applications.

17. The terminal assembly of claim 16, wherein the medical implant applications include cardiac pacemakers, implantable cardioverter defibrillators, cochlear implants, neuro-stimulators, internal drug pumps, bone growth stimulators, artificial organs, artificial hearts, hearing assist stimulators, artificial limbs, artificial eyes, muscle actuators, and deep brain stimulators for seizure control, pain management and gene therapy.

18. The terminal assembly of claim 1, wherein the oxide resistant conductive pad is applied through a soldering process.

19. The terminal assembly of claim 1, wherein the oxide resistant conductive pad is applied through a physical vapor deposition process.

20. The terminal assembly of claim 1, wherein the oxide resistant conductive pad is applied through an electroplating process.

21. The terminal assembly of claim 1, wherein the oxide resistant conductive pad is applied through a plasma arc deposition process.

22. The terminal assembly of claim 1, wherein the oxide resistant conductive pad is applied through an ion beam process.

23. The terminal assembly of claim 1, wherein the oxide resistant conductive pad is applied through a chemical vapor deposition process.

24. The terminal assembly of claim 1, wherein the oxide resistant conductive pad is applied through a laser ablation process.

25. The terminal assembly of claim 1, wherein the oxide resistant conductive pad comprises a gold braze.

26. The terminal assembly of claim 25, wherein the oxide resistant conductive pad is attached, at least in part, to a titanium/molybdenum surface.

27. The terminal assembly of claim 1, wherein the terminal pin comprises an integral oxide resistant biostable wire bond pad on a body fluid side of the terminal assembly.

28. The terminal assembly of claim 27, wherein the wire bond pad comprises a noble metal.

29. The terminal assembly of claim 28, wherein the noble metal is taken from the group consisting of gold, platinum, and oxide resistant alloys thereof.

30. The terminal assembly of claim 27, including a mating wire bond cap attached to the terminal pin opposite the wire bond pad.

31. The terminal assembly of claim 30, wherein the wire bond cap comprises a material taken from the group consisting of tantalum, molybdenum, titanium, rhodium, titanium alloys, osmium, silver and silver alloys, vanadium, platinum, niobium, platinum alloys, stainless steel, tungsten, rhenium, zirconium, vanadium and ruthenium.

32. An EMI feedthrough filter terminal assembly, comprising:

a feedthrough filter capacitor including first and second sets of electrode plates, a passageway therethrough having a first termination surface conductively coupling the first set of electrode plates, and a plurality of second termination surfaces exteriorly coupling the second set of electrode plates;

a conductive ferrule adjacent to the feedthrough filter capacitor;

at least one conductive terminal pin extending through the passageway in conductive relation with the first set of electrode plates, and through the ferrule in non-conductive relation;

an insulator fixed to the ferrule for conductively isolating the terminal pin from the ferrule;

an oxide resistant hermetic seal between the insulator and the ferrule, the hermetic seal including a plurality of conductive pads of oxide resistant biostable material, on a surface of the ferrule conductively coupled to the plurality of second termination surfaces; and

conductive connectors extending between the respective second termination surfaces and the conductive pads.

33. The terminal assembly of claim 32, including means for hermetically sealing passage of the terminal pin through the ferrule.

34. The terminal assembly of claim 32, wherein the ferrule and the insulator comprise a pre-fabricated hermetic terminal pin subassembly.

35. The terminal assembly of claim 32, wherein the first passageway through the feedthrough filter capacitor comprises a plurality of first passageways each having a distinct first termination surface conductively coupled to a distinct first set of electrode plates, and wherein the at least one conductive terminal pin comprises a terminal pin extending through each of the plurality of first passageways.

36. The terminal assembly of claim 32, including an insulative washer disposed between the feedthrough filter capacitor and the insulator.

37. The terminal assembly of claim 36, wherein the insulative washer comprises a thermal plastic polyimide supported tape.

38. The terminal assembly of claim 37, wherein the thermal plastic polyimide supported tape comprises Ableloc.

39. The terminal assembly of claim 36, wherein the washer includes a gap adjacent to the terminal pin.

40. The terminal assembly of claim 32, including a second conductive pad of oxide resistant biostable material conductively attached to the at least one terminal pin, and means for conductively coupling the second pad to the first termination surface independently of the terminal pin.

41. The terminal assembly of claim 40, wherein the conductive pads comprise a noble metal.

42. The terminal assembly of claim 41, wherein the noble metal is taken from the group consisting of gold, platinum, and oxide resistant alloys thereof.

43. The terminal assembly of claim 40, wherein the conductive pads comprise a material taken from the group consisting of tantalum, molybdenum, titanium, rhodium, titanium alloys, osmium, silver and silver alloys, vanadium, platinum, niobium, platinum alloys, stainless steel, tungsten, rhenium, zirconium, vanadium and ruthenium.

44. The terminal assembly of claim 32, specifically constructed for medical implant applications.

45. The terminal assembly of claim 44, wherein the medical implant applications include cardiac pacemakers, implantable cardioverter defibrillators, cochlear implants, neuro-stimulators, internal drug pumps, bone growth stimulators, artificial organs, artificial hearts, hearing assist stimulators, artificial limbs, artificial eyes, muscle actuators, and deep brain stimulators for seizure control, pain management, and gene therapy.

46. The terminal assembly of claim 32, wherein the oxide resistant conductive pad comprises a gold braze.

47. The terminal assembly of claim 46, wherein the terminal pin comprises an integral oxide resistant biostable wire bond pad on a body fluid side of the terminal assembly.

48. The terminal assembly of claim 32, wherein the terminal pin comprises an integral oxide resistant biostable wire bond pad on a body fluid side of the terminal assembly.

51. The terminal assembly of claim 48, including a mating wire bond cap attached to the terminal pin opposite the wire bond pad.

52. The terminal assembly of claim 51, wherein the wire bond cap comprises a material taken from the group consisting of tantalum, molybdenum, titanium, rhodium, titanium alloys, osmium, silver and silver alloys, vanadium, platinum, niobium, platinum alloys, stainless steel, tungsten, rhenium, zirconium, vanadium and ruthenium.

49. The terminal assembly of 48, wherein the wire bond pad comprises a noble metal.

50. The terminal assembly of claim 49, wherein the noble metal is taken from the group consisting of gold, platinum, and oxide resistant alloys thereof.

53. An EMI feedthrough filter terminal assembly for use in medical implant applications, comprising:

a feedthrough filter capacitor including first and second sets of electrode plates, a plurality of passageways therethrough each having a distinct first termination surface conductively coupled to a distinct first set of electrode plates, and a plurality of second termination surfaces exteriorly coupling the second set of electrode plates;

a conductive ferrule adjacent to the feedthrough filter capacitor;

a plurality of terminal pins corresponding with the number of passageways through the feedthrough filter capacitor, each terminal pin extending through a respective passageway in conductive relation with the corresponding distinct first set of electrode plates, and through the ferrule in non-conductive relation;

an insulator fixed to the ferrule for conductively isolating the terminal pins from the ferrule, wherein the ferrule and the insulator comprise a pre-fabricated hermetic terminal pin sub-assembly;

an oxide resistant hermetic seal between the insulator and the ferrule, the hermetic seal including a plurality of conductive pads of oxide resistant biostable material on a surface of the ferrule conductively coupled to the plurality of second termination surfaces; and

conductive connectors extending between each of the respective second termination surfaces and conductive pads.

54. The terminal assembly of claim 53, including an insulative washer disposed between the feedthrough filter capacitor and the insulator.

55. The terminal assembly of claim 54, wherein the insulative washer comprises a thermal plastic polyimide supported tape.

56. The terminal assembly of claim 55, wherein the thermal plastic polyimide supported tape comprises Ableloc.

57. The terminal assembly of claim 53, including a second conductive pad of oxide resistant biostable material conductively attached to the at least one terminal pin, and means for conductively coupling the second conductive pad to the first termination surface independently of the terminal pin.

58. The terminal assembly of claim 57, wherein the conductive pads comprise a noble metal.

59. The terminal assembly of claim 58, wherein the noble metal is taken from the group consisting of gold, platinum, and oxide resistant alloys thereof.

60. The terminal assembly of claim 57, wherein the conductive pads comprise a material taken from the group consisting of tantalum, molybdenum, titanium, rhodium, titanium alloys, osmium, silver and silver alloys, vanadium, platinum, niobium, platinum alloys, stainless steel, tungsten, rhenium, zirconium, vanadium and ruthenium.

61. The terminal assembly of claim 53, including means for hermetically sealing passage of the terminal pin through the ferrule.

62. The terminal assembly of claim 53, wherein the medical implant applications include cardiac pacemakers, implantable cardioverter defibrillators, cochlear implants, neuro-stimulators, internal drug pumps, bone growth stimulators, artificial organs, artificial hearts, hearing assist stimulators, artificial limbs, artificial eyes, muscle actuators and deep brain stimulators for seizure control, pain management, and gene therapy.

63. The terminal assembly of claim 53, wherein the oxide resistant conductive pad comprises a gold braze attached, at least in part, to a titanium/molybdenum surface.

64. The terminal assembly of claim 53, wherein the oxide resistant conductive pad is applied through any one of the following:

a soldering process, a physical vapor deposition process, an electroplating process, a plasma arc deposition process, an ion beam process, a chemical vapor deposition process, or a laser ablation process.

65. The terminal assembly of claim 53, wherein the terminal pins each comprise an integral oxide resistant biostable wire bond pad on a body fluid side of the terminal assembly.

66. The terminal assembly of claim 65, wherein the wire bond pad comprises a noble metal.

67. The terminal assembly of claim 66, wherein the noble metal is taken from the group consisting of gold, platinum, and oxide resistant alloys thereof.

68. The terminal assembly of claim 65, including a mating wire bond cap attached to each terminal pin opposite the wire bond pad.

69. The terminal assembly of claim 68, wherein the wire bond cap comprises a material taken from the group consisting of tantalum, molybdenum, titanium, rhodium, titanium alloys, osmium, silver and silver alloys, vanadium, platinum, niobium, platinum alloys, stainless steel, tungsten, rhenium, zirconium, vanadium and ruthenium.