Circuit board with via through surface mount device contact

• US 20030183420A1
• Filed: 03/26/2002
• Published: 10/02/2003
• Est. Priority Date: 03/26/2002
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Dishongh, Terrance J., Horine, Bryce D.
• Granted Patent: US 6,803,527 B2
• Time in Patent Office: Days
• US Class Current: 174/262
• CPC Class Codes: H05K 1/113 Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 1/114 Pad being close to via, but not surrounding the via
• CPC Class Codes: H05K 2201/09709 Staggered pads, lands or terminals; Parallel conductors in different planes
• CPC Class Codes: H05K 2203/0455 PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
• CPC Class Codes: H05K 3/3421 Leaded components
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49147 Assembling terminal to base

Abstract

According to the invention, an embodiment of a circuit board includes a substrate having a first layer and a second layer; a surface mount device pad on the first layer of the substrate; and a via, the via being formed wholly or partially through the surface mount device contact and passing through the substrate between the first layer and the second layer.

Claims

1. A circuit board comprising:

a first layer and a second layer;

a substrate between the first layer and the second layer;

a first surface mount device pad on the first layer of the substrate; and

a first via, the first via being formed partially or wholly through the first surface mount device pad, the first via passing through the substrate between the first layer and the second layer.

2. The circuit board of claim 1, wherein the first via electrically connects the first surface mount device pad to one or more layers of the circuit board.

3. The circuit board of claim 2, wherein a signal is transmitted between the first surface mount device pad and one or more layers of the circuit board through the first via.

4. The circuit board of claim 1, wherein the circuit board further comprises:

a second surface mount device pad; and

a second via, the second via being formed partially or wholly through the second surface mount device pad, the second via passing through the substrate.

5. The circuit board of claim 4, wherein the first surface mount device pad and the second surface mount device pad are adjacent to each other, the first via and the second via being formed wholly or partially through opposite ends of the respective surface mount device pads.

6. The circuit board of claim 4, wherein the first surface mount device pad and the second surface mount device pad are adjacent to each other, the first via and the second via being formed wholly or partially through adjacent ends of the respective surface mount device pads.

7. The circuit board of claim 1, further comprising a surface mount device installed on the first layer of the substrate, a lead of the surface mount device being connected to the first surface mount device pad.

8. A circuit board comprising:

a first layer and a second layer, the first layer including a first pad for installation of an electronic component to the first layer; and

a first via in the first pad, the first via passing partially or wholly through the first pad and passing through the circuit board between the first layer and the second layer.

9. The circuit board of claim 8, wherein the first via electrically connects the first pad to the second layer.

10. The circuit board of claim 9, wherein a signal is transmitted between the first pad and the second layer using the first via.

11. The circuit board of claim 8, wherein the first layer of the circuit board further comprises a second pad for installation of the electronic component, the second pad including a second via passing partially or wholly through the second pad.

12. The circuit board of claim 11, wherein the first pad and the second pad are located adjacent to each other, the first via being formed in an end of the first pad, the second via being formed in an end of the second pad, the end of the first pad in which the first via is formed being opposed to the end of the second pad in which the second via is formed.

13. The circuit board of claim 11, wherein the first pad and the second pad are located adjacent to each other, the first via being formed in an end of the first pad, the second via being formed in an end of the second pad, the end of the first pad in which the first via is formed being adjacent to the end of the second pad in which the second via is formed.

14. The circuit board of claim 8, further comprising an electronic component coupled to the first layer, the component including a lead, the lead being coupled to the first pad.

15. A method comprising:

creating a first surface mount device contact as a part of a first layer of a circuit board; and

forming a first via through the first surface mount device contact, the first via electrically connecting the first surface mount device contact to a second layer of the circuit board.

16. The method of claim 15, further comprising:

creating a second surface mount device contact as a part of the first layer of the circuit board, the second surface device contact being adjacent to the first surface mount device contact; and

forming a second via through the second surface mount device contact.

17. The method of claim 16, wherein the first via is formed in an end of the first surface mount device contact and the second via is formed in an end of the second surface mount device contact, the end in which the first via is formed in the first surface mount device contact being opposed to the end in which the second via is formed in the second surface mount device contact.

18. The method of claim 16, wherein the first via is formed in an end of the first surface mount device contact and the second via is formed in an end of the second surface mount device contact, the end in which the first via is formed in the first surface mount device contact being adjacent to the end in which the second via is formed in the second surface mount device contact.

19. The method of claim 15, further comprising installing a surface mount device on the first layer of the circuit board, a first lead of the surface mount device being connected to the first surface mount device contact.

20. The method of claim 15, wherein the first via provides a path for a signal between the first layer and the second layer.

21. A circuit board produced by a process comprising:

creating a first surface mount device contact as a part of a first layer on a surface of a substrate; and

forming a first via through the first surface mount device contact, the first via electrically connecting the first surface mount device contact to a second layer.

22. The circuit board of claim 21, the process further comprising:

creating a second surface mount device contact as a part of the first layer, the second surface device contact being adjacent to the first surface mount device contact; and

forming a second via through the second surface mount device contact.

23. The circuit board of claim 22, wherein the second via is formed in an end of the second surface mount device contact and the first via is formed in an end of the first surface mount device contact, the end in which the first via is formed in the first surface mount device contact being opposed to the end in which the second via is formed in the second surface mount device contact.

24. The circuit board of claim 22, wherein the second via is formed in an end of the second surface mount device contact and the first via is formed in an end of the first surface mount device contact, the end in which the first via is formed in the first surface mount device contact being adjacent to the end in which the second via is formed in the second surface mount device contact.

25. The circuit board of claim 21, the process further comprising installing a surface mount device on the first layer, a first lead of the surface mount device being connected to the first surface mount device contact.

26. The circuit board of claim 21, wherein the first via provides a path for a signal between the first layer and the second layer.

27. A contact for a surface mount device comprising:

a coupling to a printed circuit board, the printed circuit board including at least a first layer and a second layer, the contact being a part of the first layer;

a first via passing through the contact, the via electrically connecting the contact to the second layer; and

a coupling to a lead of a surface mount device.

28. The contact of claim 27, wherein a signal is transmitted between the surface mount device and the second layer through the first via.

29. The contact of claim 28, wherein the via passes through the printed circuit board wholly through the contact.

30. The contact of claim 29, wherein the via passes through the printed circuit board partially through the contact and partially outside of the contact.