Two stage cooling system employing thermoelectric modules

• US 20030188538A1
• Filed: 04/04/2002
• Published: 10/09/2003
• Est. Priority Date: 04/04/2002
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Simons, Robert E., Ellsworth, Michael J. Jr., Chu, Richard C.
• Granted Patent: US 6,705,089 B2
• Time in Patent Office: Days
• US Class Current: 62/3.2
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect
• CPC Class Codes: F25B 2321/0251 by a gas
• CPC Class Codes: F25B 25/005 using primary and secondary systems
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H10N 10/13 characterised by the heat-exchanging means at the junction

Abstract

A cooling system is provided for cooling a heat generating component of an electronic device. The cooling system includes at least two cooling subsystems for a staged reduction of the temperature of a cooling fluid exposed to heat generated by the heat generated component. A first stage cooling subsystem reduces the temperature of the cooling fluid to ambient temperature or above, while a second stage cooling subsystem reduces the temperature of the cooling fluid exiting the first stage cooling subsystem to below ambient temperature. The first stage cooling subsystem is passive while the second stage cooling subsystem is active and can include one or more thermoelectric modules.

Claims

1. A cooling system for cooling a heat generating component using a cooling fluid, said cooling system comprising:

a first stage cooling subsystem, said first stage cooling subsystem reducing a temperature of the cooling fluid to ambient temperature or above; and

a second stage cooling subsystem in fluid communication with said first stage cooling subsystem, said second stage cooling subsystem further reducing temperature of the cooling fluid exiting said first cooling subsystem to below ambient temperature.

2. The cooling system of claim 1, wherein said first stage cooling subsystem comprises a first heat exchanger and said second stage cooling subsystem comprises a second heat exchanger.

3. The cooling system of claim 2, wherein said first heat exchanger is a passive heat exchanger.

4. The cooling system of claim 3, wherein said passive heat exchanger is an air-cooled heat exchanger.

5. The cooling system of claim 4, wherein said air-cooled heat exchanger includes tubes configured to carry the cooling fluid and transfer heat from the cooling fluid to fins exposed to air.

6. The cooling system of claim 5, wherein a fan moves the air exposed to the fins.

7. The cooling system of claim 3, wherein said second heat exchanger is an active heat exchanger.

8. The cooling system of claim 2, wherein said second heat exchanger is an active heat exchanger.

9. The cooling system of claim 8, wherein said active heat exchanger employs at least one thermoelectric module.

10. The cooling system of claim 8, wherein said active heat exchanger employs a refrigeration unit.

11. The cooling system of claim 1, further comprising a fan configured to assist in dissipating heat from both said first and second stage cooling apparatus.

12. The cooling system of claim 11, wherein said fan, said first stage cooling apparatus and said second stage cooling apparatus are aligned.

13. The cooling system of claim 12, wherein said first stage cooling subsystem comprises a passive cooling subsystem, and wherein said second stage cooling subsystem comprises an active cooling subsystem.

14. A method for fabricating a cooling system for cooling an electronic device using a cooling fluid, said method comprising:

thermally coupling a heat transfer device to a heat generating component, said heat transfer device being configured to carry the cooling fluid;

positioning a first stage cooling subsystem in fluid communication with an output of said heat transfer device, said first stage cooling subsystem being configured to reduce a temperature of the cooling fluid to ambient temperature or above; and

positioning a second stage cooling subsystem in fluid communication with an output of said first stage cooling subsystem, said second stage cooling subsystem being configured to reduce temperature of the cooling fluid exiting said first stage cooling subsystem below ambient temperature.

15. The method of claim 14, wherein said first stage cooling subsystem comprises a first heat exchanger and said second stage cooling subsystem comprises a second heat exchanger.

16. The method of claim 15, wherein said first heat exchanger is a passive heat exchanger.

17. The method of claim 16, wherein said passive heat exchanger is an air-cooled heat exchanger.

18. The method of claim 17, wherein said air-cooled heat exchanger includes tubes configured to carry the cooling fluid and transfer heat from the cooling fluid to fins exposed to air.

19. The method of claim 18, wherein a fan moves the air exposed to the fins.

20. The method of claim 16, wherein said second heat exchanger is an active heat exchanger.

21. The method of claim 15, wherein said second heat exchanger is an active heat exchanger.

22. The method of claim 21, wherein said active heat exchanger employs at least one thermoelectric module.

23. The method of claim 21, wherein said active heat exchanger employs a refrigeration unit.

24. The method of claim 14, further comprising a fan configured to assist in dissipating heat from both said first and second stage cooling subsystem.

25. The method of claim 24, wherein said fan, said first stage cooling subsystem and said second stage cooling subsystem are aligned.

26. The method of claim 25, wherein said first stage cooling subsystem comprises a passive cooling subsystem, and wherein said second stage cooling subsystem comprises an active cooling subsystem.

27. A method for cooling an electronic device using a cooling fluid, said method comprising:

reducing, in a first stage, the temperature of the cooling fluid to ambient temperature or above; and

reducing, in a second stage, temperature of the cooling fluid exiting the first stage to below ambient temperature.