Method for constructing a membrane probe using a depression

• US 20030192183A1
• Filed: 04/16/2003
• Published: 10/16/2003
• Est. Priority Date: 06/04/1999
• Status: Active Grant

• Current Assignee: FormFactor Beaverton, Inc. (FormFactor Incorporated)
• Original Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Inventors: Smith, Kenneth, Gleason, Reed, Bayne, Michael A.
• Granted Patent: US 7,178,236 B2
• Time in Patent Office: Days
• US Class Current: 29/857
• CPC Class Codes: G01R 1/06738 related to tip portion
• CPC Class Codes: G01R 1/06744 Microprobes, i.e. having dimensions as IC details
• CPC Class Codes: G01R 1/0735 arranged on a flexible frame or film
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: H05K 2201/0367 Metallic bump or raised conductor not used as solder bump solder materials or compositions and methods of application thereof H05K3/3457
• CPC Class Codes: H05K 2201/09736 Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
• CPC Class Codes: H05K 3/205 using a pattern electroplated or electroformed on a metallic carrier
• CPC Class Codes: H05K 3/4007 Surface contacts, e.g. bumps H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3457
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base
• CPC Class Codes: Y10T 29/49174 Assembling terminal to elongated conductor
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing
• CPC Class Codes: Y10T 29/49208 by assembling plural parts
• CPC Class Codes: Y10T 29/49213 Metal
• CPC Class Codes: Y10T 29/49218 with deforming
• CPC Class Codes: Y10T 29/49815 Disassembling

Abstract

A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.

Claims

1. A method of constructing a membrane probe comprising:

(a) providing a substrate;

(b) creating a depression within said substrate;

(c) locating conductive material within said depression;

(d) connecting a conductive trace to said conductive material; and

(e) removing said substrate from said conductive material.