Semiconductor package

  • US 20030197284A1
  • Filed: 02/11/2003
  • Published: 10/23/2003
  • Est. Priority Date: 02/21/2002
  • Status: Active Grant
First Claim
Patent Images

1. A semiconductor package comprising:

  • a first IC device;

    a second IC device; and

    a substrate;

    wherein the first IC device is attached to the substrate and the second IC device is attached to the first IC device;

    the semiconductor package further comprising a first electrical connection between the first IC device and the substrate and a second electrical connection between the second IC device and the substrate.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×