Lithographic apparatus and device manufacturing method

• US 20030197844A1
• Filed: 01/30/2003
• Published: 10/23/2003
• Est. Priority Date: 02/01/2002
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Mertens, Jeroen Johannes Sophia Maria
• Granted Patent: US 6,847,430 B2
• Time in Patent Office: Days
• US Class Current: 355/53
• CPC Class Codes: G03F 7/70933 Purge, e.g. exchanging fluid or gas to remove pollutants

Abstract

In a lithographic projection apparatus, ingress of contaminants to a component is prevented by providing a first flow of purge gas through the inside of a first compartment encapsulating the component and a second flow of purge gas to an external surface of the compartment.

Claims

1. A lithographic projection apparatus, comprising:

a radiation system constructed and arranged to provide a projection beam of radiation;

a support structure constructed and arranged to supporting a patterning device, the patterning device constructed and arranged to pattern the projection beam according to a desired pattern;

a substrate table to hold a substrate;

a projection system constructed and arranged to project the patterned beam onto a target portion of the substrate;

a first compartment with a contaminant sensitive component within it;

a first gas supply constructed and arranged to purge the interior of the first compartment with a first purge gas; and

a second gas supply constructed and arranged to supply a flow of a second purge gas to an exterior surface of an enclosure defining the first compartment.

2. An apparatus according to claim 1, wherein the second purge gas has a lower contaminant fraction than air surrounding the first compartment.

3. An apparatus according to claim 1, wherein the first compartment at least partially surrounds the projection system.

4. An apparatus according to claim 1, further comprising a second compartment surrounding the first compartment, wherein the second gas supply is constructed and arranged to purge the space between the first and second compartments.

5. An apparatus according to claim 4, further comprising:

an opening in the second compartment; and

a link passing through the opening, wherein said link provides a connection between the first compartment and a component located outside the second compartment.

6. An apparatus according to claim 5, wherein the second compartment further comprises an interface shield surrounding said opening and extending from the second compartment.

7. An apparatus according to claim 6, further comprising a seal between the link and the interface shield.

8. An apparatus according claim 5, wherein the second compartment comprises a gas outlet on one side of the opening and a gas extractor on an opposite side of the opening, thereby covering the opening with a gas curtain.

9. An apparatus according to claim 1, wherein the second gas supply is constructed and arranged to provide a curtain of purge gas across at least one face of the first compartment.

10. An apparatus according to claim 1, wherein said second gas supply means provides a plurality of outlets for purge gas close to at least one face of the first compartment.

11. An apparatus according to claim 1, wherein the first compartment comprises an outlet exhausting the first purge gas after having purged the interior of the first compartment, said outlet generating an additional flow of purge gas to the exterior surface of the enclosure defining the first compartment.

12. An apparatus according to claim 11, wherein the outlet is connected to a gas mixer constructed and arranged to mix the first purge gas exhausted from the first compartment with the second purge gas and supply the gas mixture to the exterior surface of the enclosure defining the first compartment.

13. An apparatus according to claim 1, wherein the first or second gas supply is constructed and arranged to supply a gas from the group consisting of N₂, He, Ar, Kr, Ne, Xe or a mixture of two or more of these.

14. A device manufacturing method, comprising:

providing a substrate that is at least partially covered by a layer of radiation-sensitive material;

providing a projection beam of radiation using a radiation system;

using a patterning device to endow the projection beam with a pattern in its cross-section;

projecting the patterned beam of radiation onto a target portion of the layer of radiation-sensitive material;

providing a first flow of purge gas to purge the interior of a compartment containing a contaminant sensitive component of a device manufacturing apparatus; and

providing a second flow of purge gas to an exterior surface of an enclosure defining the compartment in order to purge the exterior surface.