Minimizing whisker growth in tin electrodeposits

  • US 20030201188A1
  • Filed: 04/30/2002
  • Published: 10/30/2003
  • Est. Priority Date: 04/30/2002
  • Status: Active Grant
First Claim
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1. A method for reducing tin whisker formation in tin deposits, which comprises plating tin deposits on a metal which deposits are predominantly in a predetermined crystal orientation that essentially matches that of the underlying metal in order to inhibit tin whisker growth.

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